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A Quantitative Analysis For The Stress Field Around An Elastoplastic Indentation/contact

机译:弹塑性压痕/接触点周围应力场的定量分析

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摘要

In our previous paper [G. Feng et al., Acta Mater. 55, 2929 (2007)], an analytical model is proposed to estimate the stress field around an elastoplastic indentation/contact, matching nicely with the finite element analysis. The model is related to an embedded center of dilatation (ECD) in a half-space. In this paper, we focus on determining the ECD strength 6* and the ECD depth ξ,. By matching an expanding cavity model and the ECD model, we find that B~* ≈ Yc~3/6 and ξ, ≈ 0.4c, where Y is the yield strength and c is the plastic zone radius. We provide a method to predict Y, c, and thereby B~* as well as ξ, through nanoindentation data, and we also demonstrate that pileup is the physical reason for the existence of the upper limit for the ratio of hardness to Y. Thus, our ECD model is completed by combining our previous paper (the analytical expression) and this paper (the essential parameters).
机译:在我们以前的论文[G. Feng等,Acta Mater。 55,2929(2007)],提出了一种解析模型来估算弹塑性压痕/接触周围的应力场,与有限元分析很好地匹配。该模型与半空间中的嵌入式膨胀中心(ECD)有关。在本文中,我们专注于确定ECD强度6 *和ECD深度ξi。通过匹配膨胀腔模型和ECD模型,我们发现B〜*≈Yc〜3/6和ξ,≈0.4c,其中Y是屈服强度,c是塑性区半径。我们提供了一种通过纳米压痕数据预测Y,c以及B〜*以及ξ的方法,并且我们还证明了堆积是存在硬度与Y之比上限的物理原因。 ,我们的ECD模型是通过结合之前的论文(分析表达式)和本文(基本参数)而完成的。

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