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Nanoindentation Of Thin Films: Simulations And Experiments

机译:薄膜的纳米压痕:模拟和实验

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Atomistic simulations of nanoindentation of a 20-nm-thick Ni thin film oriented in the [111] direction were carried out to study the effects of indenter velocity and radii, interatomic potentials, and the boundary conditions used to represent the substrate. The simulation results were compared directly with experimental results of Ni thin film of the same thickness and orientation. It was found that the high indenter velocity does not affect the hardness value significantly. Different radii used for indentation also have negligible effects on the hardness value. Two different interatomic potentials were tested, giving significantly different hardness values but both within 20% of the experimental result. Different boundary conditions used to represent the substrate have a significant effect for relatively deep indentation simulations.
机译:为了研究压头速度和半径,原子间电势以及代表衬底的边界条件的影响,对在[111]方向上取向的20 nm厚的Ni薄膜的纳米压痕进行了原子模拟。将模拟结果直接与相同厚度和方向的Ni薄膜的实验结果进行比较。发现高的压头速度不会显着影响硬度值。用于压痕的不同半径对硬度值的影响也可以忽略不计。测试了两种不同的原子间电势,给出了明显不同的硬度值,但均在实验结果的20%之内。用来表示基板的不同边界条件对于相对较深的压痕模拟具有重大影响。

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