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首页> 外文期刊>Journal of Materials Research >Initial interfacial reaction layers formed in Sn-3.5Ag solder/electroless Ni-P plated Cu substrate system
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Initial interfacial reaction layers formed in Sn-3.5Ag solder/electroless Ni-P plated Cu substrate system

机译：在Sn-3.5Ag焊料/化学镀Ni-P的Cu衬底系统中形成的初始界面反应层

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摘要

Analytical electron microscopy (AEM) was used to examine the initial interfacial reaction layers between a eutectic Sn-3.5Ag solder and an electroless nickel-immersion gold-plated (ENIG) Cu substrate during reflow at 255 ℃ for 1 s. AEM confirmed that a thick upper (Au,Ni)Sn_2 layer and a thin Ni_3Sn_4 layer had formed through the reaction between the solder and ENIG. The amorphous electroless Ni(P) plated layer transformed into two P-rich Ni layers. One is a crystallized P-rich Ni layer, and the other is an intermediate state P-rich Ni layer before the crystallization. The crystallized P-rich layer consisted of Ni_2P and Ni_(12)P_5. A thin Ni_2P layer had formed underneath the Ni_3Sn_4 layer and is believed to be a predecessor of the Ni_2SnP ternary phase. A Ni_(12)P_5 phase was observed beneath the Ni_2P thin layer. In addition, nanocrystalline Ni was found to coexist with the amorphous Ni(P) phase in the intermediate state P-rich Ni layer.
机译：在255℃回流1 s的过程中，用分析电子显微镜（AEM）检查了共晶Sn-3.5Ag焊料与化学镀镍镀金（ENIG）Cu衬底之间的初始界面反应层。 AEM证实，通过焊料与ENIG之间的反应，形成了厚的上层（Au，Ni）Sn_2和薄的Ni_3Sn_4层。非晶态化学镀Ni（P）层转化为两个富P的Ni层。一个是结晶的富P的Ni层，另一个是结晶前的中间态P富的Ni层。结晶的富P层由Ni_2P和Ni_（12）P_5组成。在Ni_3Sn_4层下面形成了一个薄的Ni_2P层，被认为是Ni_2SnP三元相的前身。在Ni_2P薄层下方观察到Ni_（12）P_5相。此外，发现在中间态富P的Ni层中，Ni纳米晶与非晶Ni（P）相共存。

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