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Micromolding three-dimensional amorphous metal structures

机译：微成型三维非晶态金属结构

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In this article, we report a simple and inexpensive approach to micromolding of complex, three-dimensional, high aspect ratio structures (with non-line-of-sight features) out of a high-strength amorphous metal. Inexpensive sacrificial silicon molds were created using lithography and etching techniques originally developed for integrated circuit production by the microelectronics industry and later adopted for microelectromechanical (MEMS) manufacturing. Multiple silicon layers were stacked, and the metallic glass was forced into the cavities under heat and pressure in an open air environment. Following cooling, the metallic structures were released by etching the silicon away in a potassium hydroxide (KOH) bath. Process studies showed that temperature is the most significant variable governing mold-filling. Transmission electron microscopy (TEM) sections of the mold/glass interface showed successful replication of features with characteristic dimensions on the order of 10 nanometers and no discernible gap between the silicon and the metallic glass. This scalable micromolding process leverages the inexpensive and readily available aspects of silicon lithography to economically support the mass customization (low volume production) of metal microcomponents without elaborate infrastructure needs.
机译：在本文中，我们报告了一种简单且廉价的方法，该方法是用高强度非晶态金属对复杂的三维高纵横比结构（具有非视线特征）进行微成型。廉价的牺牲硅模具是使用平版印刷术和蚀刻技术创建的，最初是由微电子行业为集成电路生产而开发的，后来又被用于微机电（MEMS）制造。堆叠多个硅层，并且在露天环境中在热和压力下将金属玻璃压入空腔中。冷却后，通过在氢氧化钾（KOH）浴中蚀刻掉硅来释放金属结构。工艺研究表明，温度是控制模具填充的最重要变量。模具/玻璃界面的透射电子显微镜（TEM）截面显示，特征尺寸大约为10纳米的特征已成功复制，并且硅和金属玻璃之间没有明显的间隙。这种可扩展的微成型工艺利用了廉价且易于获得的硅光刻技术，可以经济地支持金属微组件的大规模定制（小批量生产），而无需复杂的基础设施需求。

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