Prediction of formation of intermetallic compounds in diffusion couples

Huashan Liu; Hang Wang; Wenjun Zhu; Xiaoma Tao; Zhanpeng Jin

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Prediction of formation of intermetallic compounds in diffusion couples

机译：扩散对中金属间化合物形成的预测

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Formation of intermetallic compounds (IMCs) at the interface between two metals during soldering processing exerts much influence on the electrical and mechanical performance of integrate circuits (ICs). Considering both of the thermodynamic and kinetic factors (including nucleation and growth) on phase formation, a new model capable of predicting phase formation sequence at the interface between two metals with different structures has been proposed in this work. Application of this new model on the interfacial reactions between pure elemental pairs of metals such as Ni/Sn, Cu/In, Cu/Sn, and Co/Sn at different temperatures shows good agreement between predictions by this model and experimental observations.

机译：在焊接过程中，两种金属之间的界面处形成金属间化合物（IMC）对集成电路（IC）的电气和机械性能产生很大影响。考虑到相形成的热力学和动力学因素（包括成核和生长），在这项工作中提出了一种能够预测两种结构不同的金属之间的相形成顺序的新模型。该新模型在纯元素金属对（例如Ni / Sn，Cu / In，Cu / Sn和Co / Sn）在不同温度下的界面反应上的应用表明，该模型的预测与实验观察结果之间具有很好的一致性。

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来源
《Journal of Materials Research》 |2007年第6期|p.1502-1511|共10页
作者
Huashan Liu; Hang Wang; Wenjun Zhu; Xiaoma Tao; Zhanpeng Jin;
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作者单位

School of Materials Science and Engineering, Central South University, Changsha, Hunan 410083, People's Republic of China;

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收录信息美国《科学引文索引》(SCI);美国《工程索引》(EI);美国《生物学医学文摘》(MEDLINE);
原文格式 PDF
正文语种 eng
中图分类工程材料学;
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1. Prediction of Intermetallic Compound Formation Sequences in Pseudo Binary Diffusion Couples: Experimental Examinations for (Sn-xZn)/Cu (x=2, 5, 10, 15, 20 and 25 mass%) by a Kinetic Model with Thermodynamic Data Using MDR Diagram [J] . Terashima Shinichi, Sasaki Tsutomu Materials transactions . 2014,第11期

机译：伪二元扩散偶中金属间化合物形成顺序的预测：（Sn-xZn）/ Cu（x = 2、5、10、15、20和25质量％）的动力学模型的热力学实验数据，使用MDR图
2. The formation of intermetallic compounds during interdiffusion of Mg-Al/Mg-Ce diffusion couples [J] . Jiahong Dai, Bin Jiang, Xin Li Journal of Alloys and Compounds: An Interdisciplinary Journal of Materials Science and Solid-state Chemistry and Physics . 2015,第Null期

机译：Mg-Al / Mg-Ce扩散对互扩散过程中金属间化合物的形成
3. The formation of intermetallic compounds during interdiffusion of Mg-Al/Mg-Ce diffusion couples [J] . Jiahong Dai, Bin Jiang, Xin Li Journal of Alloys and Compounds: An Interdisciplinary Journal of Materials Science and Solid-state Chemistry and Physics . 2014,第Null期

机译：Mg-Al / Mg-Ce扩散对互扩散过程中金属间化合物的形成
4. Studies on the Formation of Intermetallic Compound Layers in Co(W)-Zn Diffusion Couples [C] . T. Ebner, N. Korbler, S. Luidold Annual Meeting Exhibition of The Minerals, Metals Materials Society . 2020

机译：CO（W）-ZN扩散耦合中金属间化合物层形成的研究
5. Intermetallic phase formation and breakdown of molybdenum diffusion barriers in nickel-molybdenum-copper and nickel - molybdenum - Monel 400 diffusion triads [D] . Shueh, Yinsheng. 1988

机译：镍-钼-铜和镍-钼-Monel 400扩散三元态中金属间相的形成和钼扩散壁垒的破坏
6. Interdiffusion and Intermetallic Compounds at Al/Cu Interfaces in Al-50vol.Cu Composite Prepared by Solid-State Sintering [O] . Dasom Kim, Kyungju Kim, Hansang Kwon 2021

机译：Al-50Vol中的Al / Cu接口在Al / Cu接口中的间隔和金属间化合物。通过固态烧结制备的％Cu复合材料
7. Intermetallic compound formation in annealed Au/Al thin film diffusion couple. [O] . Hidenori TOMIOKA, Hideo KITAMURA, Shigetomo UEDA 1987

机译：退火AU / Al薄膜扩散耦合中的金属间化合物形成。
8. Model-based predictions of solid state intermetallic compound layer growth in hybrid microelectronic circuits [R] . Vianco, P. T. , Erickson, K. L. , Hopkins, P. L. 1997

机译：基于模型的混合微电子电路中固态金属间化合物层生长预测

Prediction of formation of intermetallic compounds in diffusion couples

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