首页> 外文期刊>Journal of Materials Research >Structural characterization of electrodeposited nanophase Ni-Cu alloys
【24h】

Structural characterization of electrodeposited nanophase Ni-Cu alloys

机译:电沉积纳米相Ni-Cu合金的结构表征

获取原文
获取原文并翻译 | 示例
           

摘要

An investigation of Ni-Cu alloys electrodeposited from aqueous bath, using both direct current (dc) and pulsed current (pc) deposition techniques, has revealed many interesting features: A modulated structure with typical layer thickness of 90 and 75 nm of copper-rich and nickel-rich layers, respectively, is formed in dc plating. A surprising observation was that the modulation direction was parallel to the substrate, unlike in the case of artificial multilayers wherein it is along the growth direction. No such compositional modulations were observed in pc-plating in the present work. Spinodal phase separation, accompanied by Ll_0 ordering, was found to have occurred in the as deposited samples in both the cases. The size of the deposited crystals in both the cases has been found to be in the range of 2.5-30 nm. Detailed high-resolution transmission electron microscopy has shown that the atomic arrangements are nearly perfect right upto the boundaries of the nanosized grains.
机译:使用直流(dc)和脉冲电流(pc)沉积技术对从水浴中电沉积的Ni-Cu合金进行的研究发现了许多有趣的特征:一种调制结构,典型的层厚为90和75 nm的富铜在直流电镀中分别形成一层和一层富镍层。令人惊讶的观察是,与其中沿着生长方向的人造多层的情况不同,调制方向平行于基底。在目前的工作中,在pc电镀中没有观察到这样的成分调制。在这两种情况下,在沉积样品中均发生了旋节线相分离,并伴有Ll_0排序。在两种情况下,沉积晶体的尺寸都在2.5-30nm的范围内。详细的高分辨率透射电子显微镜显示,直到纳米晶粒的边界,原子排列几乎是完美的。

著录项

  • 来源
    《Journal of Materials Research》 |2006年第1期|p.45-61|共17页
  • 作者单位

    Materials Processing Division, Materials Group, Bhabha Atomic Research Centre, Mumbai 400 085, India;

  • 收录信息 美国《科学引文索引》(SCI);美国《工程索引》(EI);美国《生物学医学文摘》(MEDLINE);
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类 工程材料学;
  • 关键词

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号