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首页> 外文期刊>Journal of Materials Research >Interfacial reactions in the Sn-9Zn-(xCu)/Cu and Sn-9Zn-(xCu)/Ni couples
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Interfacial reactions in the Sn-9Zn-(xCu)/Cu and Sn-9Zn-(xCu)/Ni couples

机译：Sn-9Zn-（xCu）/ Cu和Sn-9Zn-（xCu）/ Ni对中的界面反应

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摘要

Sn-Zn-based alloys are promising low melting-point Pb-free solders, and it has been reported that their wetting properties and oxidation resistance can be improved with the addition of Cu. The interfacial reactions in the Sn-9 wt% Zn-xCu/Cu couples at 250 degrees C and Sn-9 wt% Zn-xCu/Ni at 280 degrees C were examined in this study. A thick gamma-Cu5Zn8 phase layer and a very thin beta '-CuZn phase layer were formed in both the Sn-9 wt% Zn/Cu and the Sn-9 wt% Zn-1 wt% Cu/Cu couples. The gamma-Ni5Zn21 phase layer was formed in both the Sn-9 wt% Zn/Ni and Sn-9 wt% Zn-1 wt% Cu/Ni couples. With longer reaction time, the delta-Ni3Sn4 phase were formed in the Sn-9 wt% Zn/Ni couple as well. In both the Cu and Ni couples, the Zn-containing gamma phases were uniform and planar and were the dominant reaction products. However, when the Cu content of the Sn-9 wt% Zn-xCu solders was 10 wt%, the interfacial reaction product becomes the eta-Cu6Sn5 phase in both the Cu and Ni couples.
机译：Sn-Zn基合金是有前途的低熔点无铅焊料，据报道，添加Cu可以改善其润湿性和抗氧化性。在这项研究中，我们研究了在250摄氏度的Sn-9 wt％Zn-xCu / Cu对和在280摄氏度的Sn-9 wt％Zn-xCu / Ni中的界面反应。在Sn-9 wt％Zn / Cu和Sn-9 wt％Zn-1 wt％Cu / Cu对中都形成了厚的γ-Cu5Zn8相层和非常薄的β'-CuZn相层。在Sn-9 wt％Zn / Ni和Sn-9 wt％Zn-1 wt％Cu / Ni对中都形成了γ-Ni5Zn21相层。随着反应时间的延长，在Sn-9 wt％的Zn / Ni对中也形成了δ-Ni3Sn4相。在铜和镍对中，含锌的γ相均一且呈平面状，是主要的反应产物。然而，当Sn-9重量％的Zn-xCu焊料的Cu含量为10重量％时，在Cu和Ni对中，界面反应产物变为η-Cu6Sn5相。

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