Electrical conductivity changes in bulk Sn, and eutectic Sn-Ag in bulk and in joints, from aging and thermal shock

F. Guo; J.G. Lee; T. Hogan

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Electrical conductivity changes in bulk Sn, and eutectic Sn-Ag in bulk and in joints, from aging and thermal shock

机译：由于老化和热冲击，散装锡和散装及接头中的共晶锡银的电导率变化

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Electrical conductivity of electronic interconnects made with Sn-based solders undergo a significant amount of deterioration during service. Several factors, such as anisotropy of Sn, coefficient of thermal expansion mismatches between the entities that make up the joint, and growth of intermetallic compounds present within the solder and solder/substrate interface, may contribute to the damage accumulation during thermal excursions and cause deterioration of properties. This study dealing with effects of aging and thermal shock on electrical conductivity, carried out with bulk Sn, and eutectic Sn-Ag in bulk and joint configurations, is aimed at evaluating the roles of the above factors on the deterioration of electrical conductivity from these thermal excursions.

机译：用锡基焊料制成的电子互连的电导率在使用过程中会大大降低。锡的各向异性，组成焊缝的实体之间的热膨胀系数不匹配以及焊料和焊料/基板界面中存在的金属间化合物的生长等因素可能会导致热偏移期间的损伤积累并导致劣化属性。这项研究涉及以块状Sn和共晶Sn-Ag的块状和接头构型进行的老化和热冲击对电导率的影响，旨在评估上述因素对这些热导率对电导率下降的影响。游览。

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来源
《Journal of Materials Research》 |2005年第2期|p.364-374|共11页
作者
F. Guo; J.G. Lee; T. Hogan;
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作者单位

Department of Chemical Engineering and Materials Science, Michigan State University, East Lansing, Michigan 48824-1226;

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收录信息美国《科学引文索引》(SCI);美国《工程索引》(EI);美国《生物学医学文摘》(MEDLINE);
原文格式 PDF
正文语种 eng
中图分类工程材料学;
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Electrical conductivity changes in bulk Sn, and eutectic Sn-Ag in bulk and in joints, from aging and thermal shock

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