Enhanced nucleation and decreased growth rates of Cu_2O in Cu_(0.5)Au_(0.5) (001) thin films during in situ oxidation

Liang Wang; Judith C. Yang

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Enhanced nucleation and decreased growth rates of Cu_2O in Cu_(0.5)Au_(0.5) (001) thin films during in situ oxidation

机译：原位氧化过程中Cu_（0.5）Au_（0.5）（001）薄膜中Cu_2O的形核增强和生长速率降低

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摘要

The initial oxidation behaviors of Cu-50 at.percent Au (001) single-crystal thin film were studied by in situ ultra-high-vacuum transmission electron microscopy to model nano-oxidation of alloys with one oxidizing component and one inert component. The oxidation behaviors such as incubation time, oxide nucleation rate, oxide growth kinetics as well as nucleation activation energy were greatly changed by the addition of nonoxidizing Au. The reasons for these changes, such as Au segregation to the top surface, a decrease in Cu activity, and reduced lattice mismatch due to the addition of Au, were discussed, and a qualitative analysis of nucleation energetics was given.

机译：通过原位超高真空透射电子显微镜研究了Cu-50原子百分数的Au（001）单晶薄膜的初始氧化行为，以模拟具有一种氧化成分和一种惰性成分的合金的纳米氧化。加入非氧化性金会极大地改变诸如保温时间，氧化物成核速率，氧化物生长动力学以及成核活化能等氧化行为。讨论了这些变化的原因，例如金在顶部表面的偏析，铜活性的降低以及由于添加金引起的晶格失配减少的原因，并给出了对成核能学的定性分析。

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来源
《Journal of Materials Research》 |2005年第7期|p.1902-1909|共8页
作者
Liang Wang; Judith C. Yang;
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Department of Materials Science and Engineering, University of Pittsburgh, Pittsburgh, Pennsylvania 15261;

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收录信息美国《科学引文索引》(SCI);美国《工程索引》(EI);美国《生物学医学文摘》(MEDLINE);
原文格式 PDF
正文语种 eng
中图分类工程材料学;
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Enhanced nucleation and decreased growth rates of Cu_2O in Cu_(0.5)Au_(0.5) (001) thin films during in situ oxidation

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