...
  • 主题
高级搜索  >
历史搜索 清空历史
首页> 外文期刊>Journal of materials science >Microstructural evolution of Cu-Sn-Ni compounds in full intermetallic micro-joint and in situ micro-bending test
【24h】

Microstructural evolution of Cu-Sn-Ni compounds in full intermetallic micro-joint and in situ micro-bending test

机译：全金属间微接头和原位微弯曲试验中Cu-Sn-Ni化合物的组织演变

获取原文
获取原文并翻译 | 示例
           
页面导航
  • 摘要
  • 著录项
  • 相似文献
  • 相关主题

摘要

This study focuses on the microstructural evolution process of Cu–Sn–Ni intermetallic compounds (IMCs) interlayer in the micro-joints, formed from the initial Ni/Sn (1.5 µm)/Cu structure through transient liquid phase (TLP) soldering. Under the bonding temperature of 240 °C, the micro-joints evolve into Ni/(Cu, Ni)~(6)Sn~(5)/(Cu, Ni)~(3)Sn/Cu structure, where the interfacial reactions on Cu/Sn and Sn/Ni are suppressed by the atoms diffusing from the opposite side. The thickness of (Cu, Ni)~(3)Sn layer on plated Cu layer still increases with the prolonged dwell time. When the bonding temperature was elevated to 290 °C, the phase transformation of (Cu, Ni)~(6)Sn~(5)into (Cu, Ni)~(3)Sn has been accelerated, thus the majority of IMCs interlayer is constituted with (Cu, Ni)~(3)Sn. However, a small amount of Ni-rich (Cu, Ni)~(6)Sn~(5)phases still remain near the Ni substrate and some of them close to the center-line of IMCs interlayer. The state between (Cu, Ni)~(6)Sn~(5)and the adjacent (Cu, Ni)~(3)Sn tends to reach equilibrium in Ni content based on the observation from Transmission Electron Microscope (TEM). In addition, the Cu–Sn–Ni IMCs micro-cantilevers were fabricated from these micro-joints using Focus Ion Beam (FIB) for the in situ micro-bending test, the results indicate a high ultimate tensile strength as well as the brittle fracture in the inter- and trans-granular modes.
机译：这项研究的重点是微接头中Cu-Sn-Ni金属间化合物（IMC）中间层的微观结构演变过程，该过渡层是由初始Ni / Sn（1.5µm）/ Cu结构通过瞬时液相（TLP）焊接形成的。在240°C的键合温度下，微接头演变为Ni /（Cu，Ni）〜（6）Sn〜（5）/（Cu，Ni）〜（3）Sn / Cu结构，其中发生界面反应Cu / Sn和Sn / Ni的原子被相反侧扩散的原子所抑制。随着停留时间的延长，镀铜层上的（Cu，Ni）〜（3）Sn层的厚度仍然增加。当键合温度升至290°C时，（Cu，Ni）〜（6）Sn〜（5）转变为（Cu，Ni）〜（3）Sn的相变得到加速，因此大多数IMC中间层由（Cu，Ni）〜（3）Sn构成。然而，少量富Ni（Cu，Ni）〜（6）Sn〜（5）相仍然保留在Ni衬底附近，并且其中一些靠近IMC中间层的中心线。根据透射电子显微镜（TEM）的观察，（Cu，Ni）〜（6）Sn〜（5）与相邻的（Cu，Ni）〜（3）Sn之间的状态趋于达到平衡。另外，使用聚焦离子束（FIB）从这些微接头制造了Cu-Sn-Ni IMC微悬臂梁，用于原位微弯曲试验，结果表明，其高极限拉伸强度以及脆性断裂在晶间和跨晶模式。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱：kefu@zhangqiaokeyan.com

京公网安备：11010802029741号 ICP备案号：京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有

  • 客服微信

  • 服务号