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首页> 外文期刊>Journal of materials science >Impact of Sb additives on solidification performance, microstructure enhancement and tensile characteristics of Sn-6.5Zn-0.3Cu Pb-free solder alloy
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Impact of Sb additives on solidification performance, microstructure enhancement and tensile characteristics of Sn-6.5Zn-0.3Cu Pb-free solder alloy

机译：Sb添加剂对Sn-6.5Zn-0.3Cu无铅焊料合金的凝固性能，显微组织增强和拉伸性能的影响

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摘要

Solidification behavior, melting range, microstructure evolution plus tensile characteristics of Sn-6.5Zn-0.3Cu-(x=0.0, 1.0, 3.0) wt% Sb alloys have been researched [it is abbreviated as SZC-xSb]. Solidification behavior has supported by creating an insoluble intermetallic compounds (IMCs) which sacrificed themselves to act as additional nucleation embryos. Microstructure of the SZC-xSb alloys included black irregular stars of -Zn-8 (Cu-Sn)(5) besides dark gray polygons of new Sb2ZnSn IMC which have been created in solid solution of -Sn phase. Furthermore, merging of Sb element enhanced most of tensile parameters as results of solid solution formation and uniformly dispersion of IMCs. Furthermore, Garofalo Model was employed to detriment the deformation mechanism from values of activation energy (Q) and stress exponent (n) of investigated alloys. The Q value of SZC-3.0Sb ally is more than SZC-1.0Sb and SZC-0.0Sb by 31.7% and 96.2%, respectively. The augment in Q values with increasing of Sb addition can be attributed to solid solution hardening and dispersion strengthening mechanisms. Based on values of Q and n the deformation mechanism can be proposed as a dislocation climb which dominating with dislocation pipe diffusion as well as lattice diffusion mechanism in range of tested temperature.
机译：已经研究了Sn-6.5Zn-0.3Cu-（x = 0.0，1.0，3.0）wt％Sb合金的凝固行为，熔化范围，微观组织演变以及拉伸特性[缩写为SZC-xSb]。固化行为通过产生不溶性金属间化合物（IMC）来支持，该化合物会牺牲自身以充当其他成核胚。 SZC-xSb合金的微观结构包括-Zn-8（Cu-Sn）（5）黑色不规则星体，以及在-Sn相固溶体中生成的新Sb2ZnSn IMC的深灰色多边形。此外，作为固溶体形成和IMC均匀分散的结果，Sb元素的合并增强了大多数拉伸参数。此外，采用Garofalo模型从所研究合金的活化能（Q）和应力指数（n）值中破坏变形机理。 SZC-3.0Sbally的Q值分别比SZC-1.0Sb和SZC-0.0Sb高31.7％和96.2％。随着Sb添加量的增加，Q值的增加可归因于固溶硬化和弥散强化机制。基于Q和n的值，可以将变形机理提出为位错爬升，该位错爬升主要由位错管扩散以及在测试温度范围内的晶格扩散机理决定。

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  • 来源
    《Journal of materials science》 |2019年第7期|6507-6518|共12页
  • 作者

    Eid E. A.; El-Khawas E. H.; Abd-Elrahman Ashraf S.;

  • 作者单位

    Higher Technol Inst, Dept Basic Sci, 10th Of Ramadan City 44629, Egypt;

    Higher Technol Inst, Dept Basic Sci, 10th Of Ramadan City 44629, Egypt;

    Higher Technol Inst, Dept Basic Sci, 10th Of Ramadan City 44629, Egypt|Zagazig Univ, Fac Sci, Phys Dept, Zagazig, Egypt;

  • 收录信息 美国《科学引文索引》(SCI);美国《工程索引》(EI);美国《生物学医学文摘》(MEDLINE);
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  • 正文语种 eng
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