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首页> 外文期刊>Journal of materials science >Pressureless sintering bonding using hybrid microscale Cu particle paste on ENIG, pure Cu and pre-oxidized Cu substrate by an oxidation-reduction process
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Pressureless sintering bonding using hybrid microscale Cu particle paste on ENIG, pure Cu and pre-oxidized Cu substrate by an oxidation-reduction process

机译：在氧化镍，纯铜和预氧化铜基材上通过氧化还原工艺在混合微细铜颗粒浆料上进行无压烧结结合

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摘要

Abstract To investigate the properties of the oxidation-reduction bonding (ORB) process with different kinds of microscale Cu particles, we characterized the microstructure and shear strength of ORB-produced joints using micro-scale flake-shaped Cu particles, spherical Cu particles, and their hybrid particle pastes. The Cu-Cu joints were bonded with the ORB process at 300 ℃ for 60 min without pressure, and 31.2 MPa shear strength was achieved by using the hybrid particle paste comprising 75 mass.% flake-shaped Cu particles and 25 mass.% spherical Cu particles. Moreover, ORB joints were also fabricated with pre-oxidized Cu and electroless nickel/immersion gold (ENIG)-finished Cu substrates. The bonded ENIG-finished Cu joint has a shear strength that is similar to that of the bonded pure Cu joint. On the other hand, the bonded pre-oxidized Cu joint shows a shear strength of 28.1 MPa, only 10% less than the shear strength of the bonded pure Cu joint. This result reveals that the shear strength of an ORB joint is insensitive to the surface condition of the substrate, which makes the ORB process acceptable in practical large-scale production.
机译：摘要为研究不同种类的微米级Cu颗粒的氧化还原键（ORB）工艺的特性，我们使用微米级片状Cu颗粒，球形Cu颗粒和他们的混合颗粒糊。 Cu-Cu接头在无压力下于300℃通过ORB工艺粘合60分钟，使用包含75质量％片状Cu颗粒和25质量％球形Cu的混合颗粒糊剂获得31.2 MPa的剪切强度。粒子。此外，ORB接头还可以使用预氧化的Cu和化学镀镍/浸金（ENIG）制成的Cu基体制造。粘结的ENIG精加工铜接头的剪切强度与粘结的纯铜接头的剪切强度相似。另一方面，粘结的预氧化铜接头的剪切强度为28.1 MPa，仅比粘结的纯铜接头的剪切强度低10％。该结果表明，ORB接头的剪切强度对基材的表面状况不敏感，这使得ORB工艺在实际的大规模生产中可以接受。

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  • 来源
    《Journal of materials science》 |2017年第7期|5554-5561|共8页
  • 作者

    Xiangdong Liu; Hiroshi Nishikawa;

  • 作者单位

    Department of Smart Green Processing, Joining and Welding Research Institute, Osaka University, 11-1 Mihogaoka, Ibaraki 567-0047, Osaka, Japan,Graduate School of Engineering, Osaka University, 2-1 Yamadaoka, Suita, Osaka 565-0871, Japan;

    Department of Smart Green Processing, Joining and Welding Research Institute, Osaka University, 11-1 Mihogaoka, Ibaraki 567-0047, Osaka, Japan;

  • 收录信息 美国《科学引文索引》(SCI);美国《工程索引》(EI);美国《生物学医学文摘》(MEDLINE);
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  • 正文语种 eng
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