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The interaction between copper and Ti_xN_y at low temperature

机译：低温下铜与Ti_xN_y的相互作用

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摘要

Sub- and over-stoichiometric Ti_xN_y films have been processed by varying the flow rate of nitrogen in the chamber. In order to study the copper diffusion through Ti and Ti_xN_y layers, these layers were systematically coated with a Cu layer 50 nm thick. For some of the stacks a Si_3N_4 layer 50 nm thick is deposited over the Cu layer. Specimens were isothermally heat treated from 240 to 430 ℃ under primary vacuum and under argon atmosphere. Cu/ BL/SiO_2/Si and Si_3N_4/Cu/BL/SiO_2/Si stacks (where BL = Ti or Ti_xN_y) where characterized by transmission electron microscopy with energy dispersive X-ray analysis, time-of-flight secondary ion mass spectrometry and X-ray diffraction. These characterizations indicate clear differences on the copper diffusion through the system depending on the film compositions and microstructures as well as on the annealing temperature. The diffusion of copper through the Ti_xN_y and the reactivity between Cu and Ti_xN_y films strongly depend on their composition but also on the processing conditions of these films. Moreover, the performances of some of these films, with respect to copper diffusion and/or reaction, are degraded as the temperature increases from 260 to 430 ℃. Diffusion of copper through the Ti_xN_y films as well as reaction conditions are studied and discussed.
机译：通过改变反应室内的氮气流速，可以处理低于化学计量的Ti_xN_y薄膜。为了研究铜在Ti和Ti_xN_y层中的扩散，对这些层进行了系统性的涂覆，涂覆了50 nm厚的Cu层。对于某些堆叠，在铜层上沉积50 nm厚的Si_3N_4层。在初级真空和氩气气氛下，将样品在240至430℃等温热处理。 Cu / BL / SiO_2 / Si和Si_3N_4 / Cu / BL / SiO_2 / Si叠层（其中BL = Ti或Ti_xN_y），其特征在于采用透射电子显微镜，能量色散X射线分析，飞行时间二次离子质谱和X射线衍射。这些特征表明，取决于膜组成和微结构以及退火温度，铜在整个体系中的扩散存在明​​显差异。铜通过Ti_xN_y的扩散以及Cu和Ti_xN_y膜之间的反应性在很大程度上取决于它们的组成，但也取决于这些膜的加工条件。而且，随着温度从260℃升高到430℃，其中一些膜在铜扩散和/或反应方面的性能下降。研究和讨论了铜通过Ti_xN_y膜的扩散以及反应条件。

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  • 来源
    《Journal of materials science》 |2016年第2期|1679-1692|共14页
  • 作者

    Frederic Battegay; Fiqiri Hodaj;

  • 作者单位

    STMicroelectronics, 850 rue Jean Monnet, 38926 Crolles Cedex, France;

    Univ. Grenoble Alpes, SIMAP, 38000 Grenoble, France,CNRS, Grenoble INP, SIMAP, 38000 Grenoble, France;

  • 收录信息 美国《科学引文索引》(SCI);美国《工程索引》(EI);美国《生物学医学文摘》(MEDLINE);
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  • 正文语种 eng
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