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首页> 外文期刊>Journal of materials science >Effect of nano α-Fe_2O_3 additions on physical and mechanical properties of Sn-1.0Ag-0.7Cu-xFe_2O_3 low Ag lead-free solders
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Effect of nano α-Fe_2O_3 additions on physical and mechanical properties of Sn-1.0Ag-0.7Cu-xFe_2O_3 low Ag lead-free solders

机译:纳米α-Fe_2O_3的添加对Sn-1.0Ag-0.7Cu-xFe_2O_3低银无铅焊料物理机械性能的影响

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摘要

In this study, the α-Fe_2O_3 nanoparticles were successfully fabricated by chemical method. Smelting technique has been used to prepare the Sn-1.0Ag-0.7Cu-xFe_2O_3 composite solders, while the weight percent of α-Fe_2O_3 in the solders ranged from 0 to 1 wt%. The influences of α-Fe_2O_3 nanoparticles on microstructure, melting temperature, microhardness, and coefficient of thermal expansion (CTE) of the composite solders and on mechanical properties of the composite solders joints were investigated. The results indicate that added α-Fe_2O_3 nanoparticles can remarkably improve the Vickers micro-hardness of the composite solders and decrease the CTE of composite solders, while the melting temperature of the composite solders have no obvious change, compared to the original Sn-l.0Ag-0.7Cu solder. The shear strength and tensile strength of the solder joints will be increased firstly and then decreased with the increasing of α-Fe_2O_3 in the composite solders. And the Sn-1.0Ag-0.7Cu-0.4Fe_2O_3 solder joint possesses the best shear strength and tensile strength.
机译:本研究成功地通过化学方法制备了α-Fe_2O_3纳米粒子。已经使用熔炼技术来制备Sn-1.0Ag-0.7Cu-xFe_2O_3复合焊料,而α-Fe_2O_3在焊料中的重量百分比为0-1%(重量)。研究了α-Fe_2O_3纳米粒子对复合焊料的微观结构,熔化温度,显微硬度和热膨胀系数(CTE)以及复合焊料接头力学性能的影响。结果表明,添加的α-Fe_2O_3纳米粒子可以显着提高复合焊料的维氏显微硬度,降低复合焊料的CTE,而复合焊料的熔融温度与原始Sn-1相比没有明显变化。 0Ag-0.7Cu焊料。随着复合焊料中α-Fe_2O_3的增加,焊点的剪切强度和抗拉强度将先增大然后减小。 Sn-1.0Ag-0.7Cu-0.4Fe_2O_3焊点具有最佳的剪切强度和拉伸强度。

著录项

  • 来源
    《Journal of materials science》 |2016年第2期|1507-1519|共13页
  • 作者单位

    The School of Materials Science and Engineering, Beijing Institute of Technology, No. 5 Yard, Zhong Guan Cun South Street, Haidian District, Beijing 100081, People's Republic of China;

    The School of Materials Science and Engineering, Beijing Institute of Technology, No. 5 Yard, Zhong Guan Cun South Street, Haidian District, Beijing 100081, People's Republic of China;

    The School of Materials Science and Engineering, Beijing Institute of Technology, No. 5 Yard, Zhong Guan Cun South Street, Haidian District, Beijing 100081, People's Republic of China,Beijing Microelectronics Technology Institute, Beijing 100076, People's Republic of China;

    The School of Materials Science and Engineering, Beijing Institute of Technology, No. 5 Yard, Zhong Guan Cun South Street, Haidian District, Beijing 100081, People's Republic of China;

    The School of Materials Science and Engineering, Beijing Institute of Technology, No. 5 Yard, Zhong Guan Cun South Street, Haidian District, Beijing 100081, People's Republic of China;

    The School of Materials Science and Engineering, Beijing Institute of Technology, No. 5 Yard, Zhong Guan Cun South Street, Haidian District, Beijing 100081, People's Republic of China;

  • 收录信息 美国《科学引文索引》(SCI);美国《工程索引》(EI);美国《生物学医学文摘》(MEDLINE);
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  • 正文语种 eng
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