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首页> 外文期刊>Journal of Materials Science. Materials in Electronics >Development of Sn-Ag-Cu and Sn-Ag-Cu-X alloys for Pb-free electronic solder applications
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Development of Sn-Ag-Cu and Sn-Ag-Cu-X alloys for Pb-free electronic solder applications

机译：开发无铅电子焊料应用的Sn-Ag-Cu和Sn-Ag-Cu-X合金

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摘要

The global electronic assembly community is striving to accommodate the replacement of Pb-containing solders, primarily Sn-Pb alloys, with Pb-free solders due to environmental regulations and market pressures. Of the Pb-free choices, a family of solder alloys based on the Sn-Ag-Cu (SAC) ternary eutectic (T_(eut). = 217℃) composition have emerged with the most potential for broad use across the industry, but the preferred (typically near-eutectic) composition is still in debate. This review will attempt to clarify the characteristic microstructures and mechanical properties of the current candidates and recommend alloy choices, a maximum operating temperature limit, and directions for future work. Also included in this review will be an exploration of several SAC + X candidates, i.e., 4th element modifications of SAC solder alloys, that are intended to control solder alloy undercooling and solidification product phases and to improve the resistance of SAC solder joints to high temperature thermal aging effects. Again, preliminary alloy recommendations will be offered, along with suggestions for future work.
机译：由于环境法规和市场压力，全球电子组装界正在努力适应用无铅焊料替换含铅焊料（主要是锡铅合金）的问题。在无铅选择中，出现了一系列基于Sn-Ag-Cu（SAC）三元共晶（T_（eut）。= 217℃）成分的焊料合金，具有在整个行业中广泛使用的最大潜力，但是优选的（通常是近共晶的）组成仍在争论中。这篇综述将试图阐明当前候选材料的特征微观结构和机械性能，并推荐合金选择，最高工作温度极限以及未来工作的方向。本评价中还将探讨几种SAC + X候选材料，即SAC焊料合金的第4种元素修饰，旨在控制焊料合金的过冷和凝固产物相，并提高SAC焊料接头的耐高温性热老化效应。同样，将提供初步的合金建议，以及对未来工作的建议。

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