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首页> 外文期刊>Journal of Materials Science. Materials in Electronics >Dielectric response of an epoxy resin when exposed to high temperatures
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Dielectric response of an epoxy resin when exposed to high temperatures

机译：环氧树脂在高温下的介电响应

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摘要

Epoxy resins are popular insulators that are used for the encapsulation of integrated circuits and for the fabrication of printed circuits boards. As such, it is important to evaluate their reliability when exposed to an environmental stress. This work reports on the influence of a high-temperature thermal stress (400 degrees C on the dielectric properties of an acid-anhydride cured DGEBA resin. Gold/epoxy/gold capacitors are used as a test structure. The Studied electrical properties are the dielectric constant and the loss factor in the 10(-1) Hz-100 kHz range, and the DC resistivity. It is found that cycling the sample for several minutes to temperatures as high as 400 degrees C has almost no effect on its dielectric properties. It is believed that the gold electrodes prevent the thermooxidative degradation of the Underlying epoxy. Electrical properties are also studied at high temperatures in the 200 degrees C-400 degrees C range. Above 200 degrees C the DC resistivity is considerably increased, as well as the loss in the low-frequency part of the spectrum (< 1 kHz). At high frequencies (> 1 kHz) the epoxy maintains good dielectric performances up to 400 degrees C.
机译：环氧树脂是流行的绝缘体，用于集成电路的封装和印刷电路板的制造。因此，重要的是要评估其在环境压力下的可靠性。这项工作报告了高温热应力（400摄氏度）对酸酐固化的DGEBA树脂的介电性能的影响。金/环氧/金电容器用作测试结构。研究的电性能为电介质常数，损耗因子（在10（-1）Hz-100 kHz范围内）和直流电阻率，发现将样品循环数分钟至高达400摄氏度的温度对其介电性能几乎没有影响。据认为，金电极可防止基础环氧树脂的热氧化降解，还研究了在200摄氏度至400摄氏度范围内的高温下的电性能，在200摄氏度以上时，直流电阻率显着提高，以及频谱的低频部分（<1 kHz）的损耗；在高频（> 1 kHz）下，环氧树脂在高达400摄氏度的温度下仍保持良好的介电性能。

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