• 主题
高级搜索  >
历史搜索 清空历史
首页> 外文期刊>Journal of Materials Science. Materials in Electronics >Effect of solder filler thickness on the mechanical stability of fiber-solder-ferrule joint under temperature cyclic loading
【24h】

Effect of solder filler thickness on the mechanical stability of fiber-solder-ferrule joint under temperature cyclic loading

机译：温度循环载荷下焊锡填充剂厚度对纤维-金属-金属-金属接头的机械稳定性的影响

获取原文
获取原文并翻译 | 示例
           
页面导航
  • 摘要
  • 著录项
  • 相似文献
  • 相关主题

摘要

The base materials of package and ferrule are often gold-coated Kovar and Invar, they both have relatively low coefficient of thermal expansion (CTE). Solder 63Sn37Pb dissolves Au substantially and forms brittle AuSn4, which may cause catastrophic failure in the fiber-solder-ferrule (FSF) joint in the long-term application. It is well known that thermal fatigue creep is one of the crucial factors affecting the life and reliability of a solder joint in electronic and optoelectronic assemblies. Therefore, it is important to understand the behavior of the FSF joint under thermal cyclic loading. In this study, four different thicknesses of solder filler in a FSF joint were examined. By using the finite element method (FEM), the equivalent creep strains of eutectic lead-tin solder were compared. The joints were subjected to 5 cycles of temperature cycling test, i.e., -65 to 150 degrees C. It was found that the thicker solder filler is subjected to a larger equivalent creep strain than the thinner solder filler. It is discussed the vertical shift of the optical fiber, which is sensitive to temperature and has effects on the power loss coupling. Modeling and experimental results show that 0.5 mm is the best inner diameter of ferrule that provides the lowest displacement and, thus, the lowest power loss under temperature cycle.
机译：包装和套圈的基础材料通常是镀金的科瓦合金和因瓦合金，它们都具有相对较低的热膨胀系数（CTE）。焊料63Sn37Pb会大量溶解Au并形成脆的AuSn4，这在长期应用中可能会导致光纤-焊接-金属-金属-金属-金属-金属-金属-金属-金属合金-密封件（FSF）接头的灾难性故障。众所周知，热疲劳蠕变是影响电子和光电组件中焊点寿命和可靠性的关键因素之一。因此，重要的是要了解FSF接头在热循环载荷下的行为。在这项研究中，检查了FSF接头中四种不同厚度的焊料填料。通过使用有限元方法（FEM），比较了共晶铅锡焊料的等效蠕变应变。对接头进行5个温度循环测试循环，即-65至150℃。发现较厚的焊料填料比较薄的焊料填料经受更大的当量蠕变应变。讨论了光纤的垂直位移，该垂直位移对温度敏感并且对功率损耗耦合有影响。建模和实验结果表明，0.5 mm是插芯的最佳内径，可提供最低的位移，因此在温度循环下的功耗也最低。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱：kefu@zhangqiaokeyan.com

京公网安备：11010802029741号 ICP备案号：京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有

  • 客服微信

  • 服务号