Electronic properties and applications of cluster-assembled carbon films

著录项

• 来源
  《Journal of Materials Science. Materials in Electronics》 |2006年第6期|p. 427-441|共15页
• 作者

  Bongiorno G; Podesta A; Ravagnan L; Piseri P; Milani P; Lenardi C; Miglio S; Bruzzi M; Ducati C;

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• 作者单位

  Univ Milan, Dipartimento Fis, I-20133 Milan, Italy;

  Univ Milan, CIMAINA, I-20133 Milan, Italy;

  Univ Milan, CIMAINA, I-20134 Milan, Italy;

  Univ Milan, Ist Fisiol Gen & Chim Biol, I-20134 Milan, Italy;

  Univ Florence, Dipartimento Energet, I-50139 Florence, Italy;

  Univ Cambridge, Dept Mat Sci & Met, Cambridge CB2 3QZ, England;

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• 收录信息 美国《科学引文索引》(SCI);美国《工程索引》(EI);美国《生物学医学文摘》(MEDLINE);
• 原文格式 PDF
• 正文语种 eng
• 中图分类 工程材料学;
• 关键词

  FIELD-EMISSION PROPERTIES; ABSORPTION FINE-STRUCTURE; SILICON HUMIDITY SENSOR; DOUBLE-LAYER CAPACITORS; CURVED SPONGY CARBON; DIAMOND-LIKE CARBON; NANOSTRUCTURED CARBON; BEAM DEPOSITION; AMORPHOUS-CARBON; THIN-FILMS;

  机译：场发射特性吸收精细结构硅湿度传感器双层电容器弯曲海绵钻石状碳纳米碳束沉积非晶碳薄膜;