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首页> 外文期刊>Journal of Materials Science. Materials in Electronics >Low-temperature-sintering and characterization of glass-ceramic composites
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Low-temperature-sintering and characterization of glass-ceramic composites

机译：微晶玻璃复合材料的低温烧结与表征

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摘要

To meet the demands of high power and high-speed propagation of the signal for very large scale integration, a series of glass/ceramic composites were prepared using electronic ceramics process from borosilicate glass with Sr-celsian, which contains 30, 40, 50, 60, 70 wt(percent) ceramic. The phase and microstructural evolution of the composites were characterized by XRD and SEM. The properties of the composites were also measured. Results show that the thermal expansion coefficient, dielectric constant and hardness of the composites increase with an increase content of Sr-celsian. However, the dielectric loss decreases with increasing Sr-celsian content. For the composites with >=60 wt(percent) Sr-celsian fired at 850-900 deg C, formation of alpha-quartz and cristobalite in the composites during the sintering process has bad effect on thermal expansion, but has little effect on the values of dielectric properties of the composites. The obtained composites exhibit low dielectric constant (5.2-5.8), low dielectric loss (<=0.25percent), low thermal expansion coefficient (4.4-6.2 X 10~(-6) deg C~(-1)) and low-temperature sintering behavior (<= 900 deg C), which suit for electronic packaging field.
机译：为了满足大规模集成的高功率和高速信号传输需求，采用电子陶瓷工艺，由硼硅酸盐玻璃和Sr-celsian制备了一系列玻璃/陶瓷复合材料，其中含有30、40、50， 60，70 wt（％）陶瓷。用XRD和SEM表征了复合材料的相变和微观结构演变。还测量了复合材料的性能。结果表明，随着Sr-cels含量的增加，复合材料的热膨胀系数，介电常数和硬度均增加。但是，介电损耗随Sr celsian含量的增加而降低。对于在850-900摄氏度下烧成> = 60 wt（％）Sr celsian的复合材料，在烧结过程中，复合材料中形成的α-石英和方石英对热膨胀影响不大，但对值的影响很小复合材料的介电性能。所得复合材料表现出低介电常数（5.2-5.8），低介电损耗（<= 0.25％），低热膨胀系数（4.4-6.2 X 10〜（-6）摄氏度〜（-1））和低温烧结性能（<= 900摄氏度），适合电子包装领域。

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