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首页> 外文期刊>Journal of Materials Science. Materials in Electronics >Microstructural characteristics and carbon content of Al2O3 films as a function of deposition parameters
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Microstructural characteristics and carbon content of Al2O3 films as a function of deposition parameters

机译：Al2O3薄膜的微观结构特征和碳含量与沉积参数的关系

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摘要

Microstructural characteristics and carbon content in aluminum oxide thin films deposited on silicon substrates are reported as a function of deposition parameters such as substrate temperature and molar concentration of the spraying solution. The films were deposited using the spray pyrolysis technique from a spraying solution of aluminum acetylacetonate (AI(acac)3), dissolved in N,N-dimethylformamide (N,N-DMF), at temperatures in the range from 500 to 650degreesC. Water mist was added during the deposition process and no further post deposition thermal treatments were given to these films. The films have a stoichiometry close to that expected for Al2O3, although, residual carbon from the deposition process was found to be present in these films. The surface roughness of the films was less than 20 Angstrom, with deposition rates up to 540 Angstrom/min, low chemical etch rates and activation energies around 27.6 kJ/mol were also determined.High resolution transmission electron microscopy observation of these films show the presence of a tiny 5Al(2)O(3): H2O crystalline phase embedded in a dense amorphous matrix. It was found that the average crystallite diameter of this phase depended on the deposition temperature as well as on the molar concentration of the spraying solution. (C) 2004 Kluwer Academic Publishers.
机译：据报道，沉积在硅基底上的氧化铝薄膜中的微结构特征和碳含量与沉积参数（例如基底温度和喷涂溶液的摩尔浓度）有关。使用喷雾热解技术从溶解在N，N-二甲基甲酰胺（N，N-DMF）中的乙酰丙酮铝（AI（acac）3）的喷雾溶液中沉积薄膜，温度范围为500至650°C。在沉积过程中添加了水雾，并且没有对这些膜进行进一步的沉积后热处理。该膜的化学计量比接近Al 2 O 3的化学计量比，尽管发现沉积过程中残留的碳存在于这些膜中。薄膜的表面粗糙度小于20埃，沉积速率高达540埃/分钟，还确定了低化学蚀刻速率和约27.6 kJ / mol的活化能。这些薄膜的高分辨率透射电子显微镜观察表明存在微小的5Al（2）O（3）：H2O结晶相嵌入致密的非晶态基质中。发现该相的平均微晶直径取决于沉积温度以及喷涂溶液的摩尔浓度。 （C）2004 Kluwer学术出版社。

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