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首页> 外文期刊>Journal of Materials Science >Microcapsule induced toughening in a self-healing polymer composite
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Microcapsule induced toughening in a self-healing polymer composite

机译：微胶囊诱导的自修复聚合物复合材料的增韧

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摘要

Microencapsulated dicyclopentadiene (DCPD) healing agent and Grubbs' Ru catalyst are incorporated into an epoxy matrix to produce a polymer composite capable of self-healing. The fracture toughness and healing efficiency of this composite are measured using a tapered double-cantilever beam (TDCB) specimen. Both the virgin and healed fracture toughness depend strongly on the size and concentration of microcapsules added to the epoxy. Fracture of the neat epoxy is brittle, exhibiting a mirror fracture surface. Addition of DCPD-filled urea-formaldehyde (UF) microcapsules yields up to 127% increase in fracture toughness and induces a change in the fracture plane morphology to hackle markings. The fracture toughness of epoxy with embedded microcapsules is much greater than epoxy samples with similar concentrations of silica microspheres or solid UF polymer particles. The increased toughening associated with fluid-filled microcapsules is attributed to increased hackle markings as well as subsurface microcracking not observed for solid particle fillers. Overall the embedded microcapsules provide two independent effects: the increase in virgin fracture toughness from general toughening and the ability to self-heal the virgin fracture event.
机译：将微囊化的双环戊二烯（DCPD）修复剂和Grubbs的Ru催化剂掺入环氧基质中，以生产能够自我修复的聚合物复合材料。使用锥形双悬臂梁（TDCB）样品测量该复合材料的断裂韧性和愈合效率。原始断裂韧性和愈合后的断裂韧性都很大程度上取决于添加到环氧树脂中的微囊的大小和浓度。纯环氧树脂的断裂是脆性的，表现出镜面断裂表面。添加DCPD填充的脲醛（UF）微胶囊可使断裂韧性提高多达127％，并导致断裂平面形态发生变化，从而形成斑点。具有嵌入式微囊的环氧树脂的断裂韧性远大于具有相似浓度的二氧化硅微球或固体UF聚合物颗粒的环氧树脂样品。与流体填充的微胶囊相关的增韧增加归因于固体颗粒填料未观察到的增加的斑点痕迹和地下微裂纹。总体而言，包埋的微胶囊具有两个独立的作用：通过一般增韧增加原始断裂韧性和自我修复原始断裂事件的能力。

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  • 来源
    《Journal of Materials Science》 |2004年第5期|1703-1710|共8页
  • 作者

    E. N. Brown; S. R. White; N. R. Sottos;

  • 作者单位

    Department of Theoretical and Applied Mechanics and the Beckman Institute for Advanced Science and Technology University of Illinois at Urbana-ChampaignLos Alamos National Laboratory MS-E544;

    Department of Aerospace Engineering and the Beckman Institute for Advanced Science and Technology University of Illinois at Urbana-Champaign;

    Department of Theoretical and Applied Mechanics and the Beckman Institute for Advanced Science and Technology University of Illinois at Urbana-Champaign;

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