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首页> 外文期刊>Journal of Mechanical Science and Technology >Topology optimization of a PCB substrate considering mechanical constraints and heat conductivity
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Topology optimization of a PCB substrate considering mechanical constraints and heat conductivity

机译：考虑机械约束和导热性的PCB基板拓扑优化

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摘要

A material mixing method was suggested to obtain an optimal topology for a multiple material structure with multiple thermal criteria, based on Evolutionary Structural Optimization (ESO). To examine the validity of the method, it was applied to a printed circuit board (PCB) substrate. The overall efficiency of material usage in a PCB substrate was measured in terms of the combination of thermal stress and heat flux density by using a combination strategy with weighting factors. A Pareto optimal topology solution having multiple thermal criteria was obtained. The effects of weighting factors for multiple thermal criteria as well as mechanical boundary conditions on optimal topologies were investigated. It was found that as the weighting factor for heat flux density becomes larger, the sizes of holes at the center portion become larger in order to dissipate thermal energy much more efficiently. It was also found that as the magnitudes of the heat conduction are getting larger, a similar tendency of the optimal topologies is obtained to the above. The thermal stress on the clamped four sides is larger than that on the two sides clamped. It is verified that the suggested material mixing method works very well for topology optimization of a PCB substrate for various mechanical boundary conditions with multiple thermal criteria.
机译：提出了一种材料混合方法，以基于演化结构优化（ESO），为具有多种热准则的多种材料结构获得最佳拓扑。为了检查该方法的有效性，将其应用于印刷电路板（PCB）基板。通过使用具有权重因子的组合策略，根据热应力和热通量密度的组合来测量PCB基板中材料使用的总体效率。获得具有多个热判据的帕累托最优拓扑解决方案。研究了多个热准则的加权因子以及机械边界条件对最佳拓扑的影响。已经发现，随着热通量密度的加权因子变大，中心部分的孔的尺寸变大，以便更有效地耗散热能。还发现，随着热传导的幅度变大，可获得与上述相似的最佳拓扑趋势。夹紧的四个侧面的热应力大于夹紧的两个侧面的热应力。证实了所建议的材料混合方法对于具有多种热标准的各种机械边界条件的PCB基板拓扑优化非常有效。

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