机译:分子动力学模拟研究石英玻璃多次研磨中的表面损伤层
Dalian Univ Technol, Non Tradit Machining Minist Educ, Dalian 116024, Peoples R China|Dalian Univ Technol, Key Lab Precis, Dalian 116024, Peoples R China;
Dalian Univ Technol, Non Tradit Machining Minist Educ, Dalian 116024, Peoples R China|Dalian Univ Technol, Key Lab Precis, Dalian 116024, Peoples R China;
Dalian Univ Technol, Non Tradit Machining Minist Educ, Dalian 116024, Peoples R China|Dalian Univ Technol, Key Lab Precis, Dalian 116024, Peoples R China;
Dalian Univ Technol, Non Tradit Machining Minist Educ, Dalian 116024, Peoples R China|Dalian Univ Technol, Key Lab Precis, Dalian 116024, Peoples R China;
Dalian Univ Technol, Non Tradit Machining Minist Educ, Dalian 116024, Peoples R China|Dalian Univ Technol, Key Lab Precis, Dalian 116024, Peoples R China;
Multiple grinding; Molecular dynamics; Densification; Nanoindentation hardness; Damage layer;
机译:使用分子动力学(MD)模拟在高速磨削下的Al-Si双层亚表面损伤和材料去除
机译:使用分子动力学(MD)模拟在高速磨削下al-Si双层损坏和材料去除
机译:单晶硅多次研磨中损伤层厚度的分子动力学研究
机译:硅晶片纳米磨削过程中地下损伤层的分子动力学模拟
机译:二氧化硅玻璃和高能材料中数百万至十亿个原子的分子动力学模拟,包括变形,损伤,纳米压痕和断裂。
机译:分子动力学模拟的铜表面研磨后的滚动阻力和力学性能
机译:使用分子动力学研究的Ni / Cu多层高速研磨过程中的地下损伤和材料去除机制