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Anatomy of UDP and M-VIA for cluster communication

机译：UDP和M-VIA的集群通信剖析

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摘要

High interprocess communication latency is detrimental to parallel and grid computing. Over the years, the network bandwidth has increased rapidly while the end-to-end latency has not decreased much. This is because the latency is dominated by the protocol software execution time in the kernel instead of the raw transmission time over the link. In this paper, we perform an anatomical analysis of the complete communication path between a sender and a receiver through measurements. We present an in-depth evaluation of various components of the UDP protocol over Fast Ethernet. Virtual Interface Architecture (VIA) protocol has been recently proposed to overcome the software overhead of the TCP/UDP/IP protocol. We analyze M-VIA, a modular VIA implementation for Linux over Ethernet, and compare its performance with UDP. The aim of our experiments is to present the protocol overheads in details rather than to suggest new techniques to reduce overheads.
机译：高的进程间通信等待时间不利于并行和网格计算。多年来，网络带宽迅速增加，而端到端延迟却没有减少太多。这是因为延迟是由内核中协议软件执行时间而不是链接上的原始传输时间决定的。在本文中，我们通过测量对发送者和接收者之间的完整通信路径进行了解剖分析。我们对快速以太网上的UDP协议的各个组成部分进行了深入评估。最近提出了虚拟接口体系结构（VIA）协议，以克服TCP / UDP / IP协议的软件开销。我们分析了M-VIA，这是用于Linux over Ethernet的模块化VIA实现，并将其性能与UDP进行了比较。我们实验的目的是详细介绍协议开销，而不是提出减少开销的新技术。

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