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机译:UV固化辅助注塑成型微流控芯片外观缺陷的机理及解决方法
Beijing Univ Chem Technol, Coll Mech & Elect Engn, Beijing, Peoples R China;
Beijing Univ Chem Technol, Coll Mech & Elect Engn, Beijing, Peoples R China;
Beijing Univ Chem Technol, Coll Mech & Elect Engn, Beijing, Peoples R China;
Beijing Univ Chem Technol, Coll Mech & Elect Engn, Beijing, Peoples R China;
Beijing Univ Chem Technol, Coll Mech & Elect Engn, Beijing, Peoples R China|Beijing Univ Chem Technol, State Key Lab Organ Inorgan Composites, Beijing, Peoples R China;
bubble defect; injection molding; microfluidic chips; UV-curing;
机译:具有弯曲微观结构的模具插入件的磁场辅助整理,用于注射微流体芯片
机译:注射成型PMMA微流控芯片厚度均匀性对芯片热粘合率的影响
机译:包括圆形微通道的塑料微流控芯片的微注射成型
机译:微流控芯片注射成型的质量缺陷与分析
机译:振动辅助注塑成型的研究,以提高制造效率。
机译:通过玻璃成型工艺在微流控芯片玻璃上制备微结构
机译:气体辅助注射成型:CD-ROM托盘制造工艺优化案例研究