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首页> 外文期刊>Journal of porous materials >Ceria coated hexagonal mesoporous silica core-shell composite particle abrasives for improved chemical-mechanical planarization performance
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Ceria coated hexagonal mesoporous silica core-shell composite particle abrasives for improved chemical-mechanical planarization performance

机译：Ceria涂覆的六方介孔二氧化硅核 - 壳复合颗粒研磨剂，用于改善化学机械平面化性能

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The structure design of abrasive particles provides an available approach for improving both surface roughness and polishing efficiency in chemical-mechanical planarization/polishing (CMP) applications. In this work, the hexagonal mesoporous silica (H-mSiO(2)) particles with parallel channels were prepared via a modified tyltrimethylammonium bromide-assisted template method. And the ceria nanoparticles attached to H-mSiO(2) was achieved by a solution synthesis technique. The core-shell structure of the as-prepared H-mSiO(2)-CeO2 composites was characterized in terms of X-ray diffraction, field emission scanning electron microscope, high-resolution transmission electron microscope, nitrogen adsorption/desorption measurement, and STEM-EDX mapping techniques. The oxide-CMP performance of the H-mSiO(2)-CeO2 composite particles as abrasives was evaluated in terms of surface finish and material removal rate. For comparison, the commercial ceria abrasives and solid silica (sSiO(2))-CeO2 composite particles with non-porous sSiO(2) cores were also tested under the same CMP conditions. Oxide-CMP results revealed that the H-mSiO(2)-CeO2 composite abrasives contributed to the finish reduction, efficiency improvement, and scratch elimination with respect to conventional ceria abrasives. By comparing with rigid solid silica (sSiO(2))-CeO2 particles, the non-rigid H-mSiO(2)-CeO2 composites revealed a reduced surface roughness (0.17nm vs. 0.33nm, root-mean-square values), a low topographical variation (+/- 0.4nm vs.+/- 0.8nm), and an improved removal rate (203nm/min vs. 144nm/min). The improved CMP performance might be attributed to the enhanced overall elastic response and reduced particle density, resulting from their hexagonal meso-silica cores with abundant parallel channels. Moreover, the increased Ce3+ concentration also contributed the improvement of polishing efficiency. This work describes an effort to explore the relationship between the meso-silica structure and finishing performance of the ceria-based core-shell abrasives for optimizing oxide-CMP characteristics.
机译：磨料颗粒的结构设计提供了一种用于改善化学机械平面化/抛光（CMP）应用的表面粗糙度和抛光效率的可用方法。在这项工作中，通过改性的泰国三甲基溴化铵辅助模板方法制备具有平行通道的六边形介孔二氧化硅（H-MSIO（2））颗粒。并通过溶液合成技术实现附着于H-MSIO（2）的二氧化铈纳米颗粒。以X射线衍射，现场发射扫描电子显微镜，高分辨率透射电子显微镜，氮吸附/解吸测量和茎，表征如制备的H-MSIO（2）-CE2复合材料的核 - 壳结构。 -EDX映射技术。在表面光洁度和材料去除速率方面评价H-MSIO（2）-CEO2复合颗粒作为研磨剂的氧化物-CMP性能。对于比较，商业杂交磨料和固体二氧化硅（SSIO（2）） - 具有非多孔SSIO（2）芯的CeO 2复合颗粒也在相同的CMP条件下进行测试。氧化物-CMP结果表明，H-MSIO（2）-CEO 2复合磨料有助于降低效果，效率提高，以及相对于常规CERIA磨料的划伤消除。通过与刚性固体二氧化硅（SSIO（2）） - CeO 2颗粒进行比较，非刚性H-MSIO（2）-CE2复合材料显示出降低的表面粗糙度（0.17nm与0.33nm，根平均值），低地形变化（+/- 0.4nm + / - 0.8nm），以及改善的去除率（203nm / min，vs.144nm / min）。改进的CMP性能可能归因于增强的总弹性响应和降低的颗粒密度，由其六边形Meso-Silica核心具有丰富的平行通道。此外，CE3 +浓度的增加也有助于提高抛光效率。这项工作描述了探讨了基于二氧化硅结构与基于二氧化铈的核心壳研磨剂的结合性能之间的关系，以优化氧化物-CMP特性。

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