...
首页> 外文期刊>Journal of power electronics >Thermal Model for Power Converters Based on Thermal Impedance
【24h】

Thermal Model for Power Converters Based on Thermal Impedance

机译:基于热阻的功率转换器热模型

获取原文
获取原文并翻译 | 示例
           

摘要

In this paper, the superposition principle of a heat sink temperature rise is verified based on the mathematical model of a plate-fin heat sink with two mounted heat sources. According to this, the distributed coupling thermal impedance matrix for a heat sink with multiple devices is present, and the equations for calculating the device transient junction temperatures are given. Then methods to extract the heat sink thermal impedance matrix and to measure the Epoxy Molding Compound (EMC) surface temperature of the power Metal Oxide Semiconductor Field Effect Transistor (MOSFET) instead of the junction temperature or device case temperature are proposed. The new thermal impedance model for the power converters in Switched Reluctance Motor (SRM) drivers is implemented in MATLAB/Simulink. The obtained simulation results are validated with experimental results. Compared with the Finite Element Method (FEM) thermal model and the traditional thermal impedance model, the proposed thermal model can provide a high simulation speed with a high accuracy. Finally, the temperature rise distributions of a power converter with two control strategies, the maximum junction temperature rise, the transient temperature rise characteristics, and the thermal coupling effect are discussed.
机译:本文基于装有两个热源的板翅式散热器的数学模型,验证了散热器温升的叠加原理。据此,给出了具有多个器件的散热器的分布式耦合热阻矩阵,并给出了计算器件瞬态结温的公式。然后提出了提取散热器热阻矩阵并测量功率金属氧化物半导体场效应晶体管(MOSFET)的环氧模塑化合物(EMC)表面温度的方法,而不是结温或器件外壳温度的方法。在MATLAB / Simulink中实现了开关磁阻电机(SRM)驱动器中功率转换器的新热阻抗模型。实验结果验证了所获得的仿真结果。与有限元热模型和传统的热阻抗模型相比,本文提出的热模型可以提供较高的仿真速度和精度。最后,讨论了具有两种控制策略的功率转换器的温升分布,即最大结温升,瞬态温升特性和热耦合效应。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号