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首页> 外文期刊>Journal of Spacecraft Technology >Challenges in SMT process for RF cards and its mitigation techniques
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Challenges in SMT process for RF cards and its mitigation techniques

机译：RF卡SMT过程中的挑战及其缓解技术

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摘要

Surface mount technology is preferably employed for higher throughput and better circuit reliability. PCB board for radio frequencies imposes certain challenges due to incompatible material as well as non-uniform material height. Other requirements such as PCB size, ESD sensitivity, warpage, thermal profile are also important parameters for achieving higher process yield. Critical devices such as VCO, PLL, Amplifiers chips are having body grounding and are also prone to ESD failures. The requirements for RF boards are different from the standard digital circuits for SMT process. Various materials and boards thicknesses are also employed for RF boards and this requirement generate certain restrictions on the process line. This article details the challenges imposed by the RF boards and the mitigation techniques employed to overcome the same using the SMT line.
机译：表面安装技术优选用于更高的产量和更好的电路可靠性。 电视频率的PCB板由于不兼容的材料和非均匀材料高度而造成某些挑战。 其他要求，如PCB尺寸，ESD灵敏度，翘曲，热曲线也是实现更高过程产量的重要参数。 诸如VCO，PLL，放大器芯片的关键装置具有体内接地，并且也容易发生ESD故障。 RF板的要求与SMT过程的标准数字电路不同。 RF板还采用各种材料和板厚度，并且该要求产生对过程线的某些限制。 本文详述了RF板施加的挑战以及使用SMT线克服相同的缓解技术。

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