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首页> 外文期刊>繊維学会誌 >Supercritical Fluid-assisted Electroless Copper Plating of Aramid Film:The Influence of Surface Treatment
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Supercritical Fluid-assisted Electroless Copper Plating of Aramid Film:The Influence of Surface Treatment

机译：芳纶膜超临界流体辅助化学镀铜：表面处理的影响

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摘要

A process of metalizing aramid fibers using supercritical CO_2 (sc-CO_2) followed by electroless copper plating has been developed recently. However, some applications require larger conductive surfaces without losing any of aramid fibers qualities (heat and chemical resistance, high strength, high flexibility). In response to such requirements, we developed in our present study a method of plating aramid film after impregnating it with organometallic complexes using SC-CO2 as a medium. In order to achieve uniform plating coupled with a high adhesiveness of the plated layer, two factors were examined. The impregnated Pd was reduced by two agents, NaBH_4 in aqueous solution and H_2 gas, in order to increase the amount of Pd metal present on the film surface. We found that the reduction of Pd did improve the plating of the aramid film. In spite of this, the adhesion of the shiny copper-colored layer had low strength.
机译：最近已经开发出一种使用超临界CO_2（sc-CO_2）金属化芳纶纤维并随后进行化学镀铜的工艺。但是，某些应用需要更大的导电表面，而又不丧失任何芳纶纤维的质量（耐热和耐化学性，高强度，高柔韧性）。响应于这样的要求，我们在本研究中开发了一种在以SC-CO2为介质的有机金属络合物中浸渍芳族聚酰胺薄膜后再对其进行电镀的方法。为了获得均匀的镀覆以及镀层的高粘附性，检查了两个因素。为了增加膜表面上存在的Pd金属的量，可通过两种试剂（水溶液中的NaBH_4和H_2气体）还原浸渍的Pd。我们发现，Pd的还原确实改善了芳族聚酰胺薄膜的镀层。尽管如此，发亮的铜色层的粘附强度低。

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  • 来源
    《繊維学会誌》 |2010年第9期|p.215-221|共7页
  • 作者

    MagaliBelmas; Isao Tabata; Kenji Hisada; Teruo Hori;

  • 作者单位

    Graduate School of Engineering, Fiber Amenity Engineering, University of Fukui, 3-9-1 Bunkyo,Fukui 910-8507, Japan;

    Technical Department, University of Fukui, 3-9-1 Bunkyo, Fukui 910-8507, Japan;

    Graduate School of Engineering, Fiber Amenity Engineering, University of Fukui, 3-9-1 Bunkyo,Fukui 910-8507, Japan;

    Graduate School of Engineering, Fiber Amenity Engineering, University of Fukui, 3-9-1 Bunkyo,Fukui 910-8507, Japan;

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