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首页> 外文期刊>Journal of thermal stresses >ELASTO-VISCOPLASTIC RESPONSE OF SILICON TO FEMTOSECOND LASER HEATING AT ELEVATED TEMPERATURE
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ELASTO-VISCOPLASTIC RESPONSE OF SILICON TO FEMTOSECOND LASER HEATING AT ELEVATED TEMPERATURE

机译：高温下硅对飞秒激光加热的弹黏弹响应

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摘要

The elasto-viscoplastodynamics of single-crystalline silicon in response to femtosecond laser pulsing at elevated temperature is studied. Hyperbolic energy transport dynamics is considered in conjunction with the Haasen-Sumino constitutive law to explore the thermo-elasto-visco-plastic response of the silicon material subjected to ultrafast optical heating. A computational scheme with staggered-grids is developed to time-integrate the coupled thermal-mechanical responses of silicon wafer at annealing temperatures up to 1,100 K. Non-thermal melting fluence threshold is examined favorably against published physical data. The elasto-viscoplastic response at high annealing temperature is characterized by thermal stress waves that propagate with increased oscillation amplitude and modified frequency spectrum. It is shown that the induced transverse and longitudinal displacements along with the normal stress components all establish well-defined relations with temperatures, suggesting that they may be utilized for the thermometric profiling of silicon wafers undergoing Rapid Thermal Processing (RTP) with desired thermal resolution.
机译：研究了高温下飞秒激光脉冲对单晶硅的弹黏塑性动力学的影响。结合哈森-苏米诺（Haasen-Sumino）本构定律，考虑了双曲线能量传输动力学，以研究经受超快光学加热的硅材料的热弹-粘塑性响应。开发了具有交错网格的计算方案，以对在高达1100 K的退火温度下硅晶片的耦合热机械响应进行时间积分。针对已发表的物理数据，对非热融通量阈值进行了有利检查。高退火温度下的弹黏塑性响应的特征在于，热应力波随着振荡幅度的增加和频谱的改变而传播。结果表明，所引起的横向和纵向位移以及法向应力分量均与温度建立了明确定义的关系，这表明它们可用于以所需的热分辨率对经历快速热处理（RTP）的硅片进行热分析。

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