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首页> 外文期刊>Journal of Thermophysics and Heat Transfer >Thermal Performance of Silicon-Die/Water-Cooled Heat-Sink Assembly: Experimental Investigation
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Thermal Performance of Silicon-Die/Water-Cooled Heat-Sink Assembly: Experimental Investigation

机译：硅片/水冷散热器组件的热性能：实验研究

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摘要

The heat flow across a high-powered silicon-die and water-cooled heat-sink assembly is a very important thermal challenge in many microelectronic applications. A single silicon thermal-die/water-cooled experimental facility was fabricated, and a successful experimental program was conducted. Heretofore, unpublished experimental thermal resistance data are presented for two commercially important interstitial materials over a pressure range of 103.4-210.4 kPa (15-30 psi). These results were then compared to thermal resistance data for helium gas, which was flowing at the interface between the two contacting solids. The pressure range employed represents actual operating conditions in an important microelectronic application, which involves chip functionality testing such as silicon burn-in and extended run-in functional operations.
机译：在许多微电子应用中，跨大功率硅芯片和水冷散热器组件的热流是一个非常重要的热挑战。制作了单个硅热模/水冷实验设备，并进行了成功的实验程序。迄今为止，在压力范围为103.4-210.4 kPa（15-30 psi）的情况下，给出了两种商业上重要的填隙材料的未公开实验热阻数据。然后将这些结果与氦气的热阻数据进行比较，氦气在两种接触固体之间的界面处流动。所采用的压力范围代表重要的微电子应用中的实际操作条件，其中涉及芯片功能测试，例如硅老化和扩展的磨合功能操作。

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