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首页> 外文期刊>JSME International Journal. Series C, Mechanical Systems, Machine Elements and Manufacturing >Profile and Surface Measurement Tool for High Aspect-ratio Microstructures
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Profile and Surface Measurement Tool for High Aspect-ratio Microstructures

机译：高纵横比微结构的轮廓和表面测量工具

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摘要

A MEMS device for the profile measurement of high aspect-ratio microstructures has been developed. The goal was to implement a method to be used when the conventional methods were inappropriate. The main part of the tool is a silicon micro-probe with a sharp tip at its end and an integrated piezoresistive strain gauge sensor. The probes are from 500μm to 1 mm long with a cross section area of 20×20 μm{sup}2; they were mainly designed for the characterization of narrow and deep "EDM" micromachined micro-holes having a radius as small as 50μm and a depth up to 800μm. The profile measurement method has been extended to the characterization of several other microstructures. The measurement accuracy is about ±30nm.
机译：已经开发出用于高纵横比微结构的轮廓测量的MEMS装置。目的是实现一种在常规方法不合适时要使用的方法。该工具的主要部分是硅微探针，其末端具有锋利的尖端和集成的压阻应变仪传感器。探针的长度为500μm至1mm，横截面积为20×20μm{sup} 2。它们主要用于表征半径为50μm且深度最大为800μm的窄而深的“ EDM”微加工微孔。轮廓测量方法已扩展到其他几个微结构的表征。测量精度约为±30nm。

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