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Analysis of Stress Intensity Factor for Interfacial Crack in Bonded Dissimilar Plate under Bending

机译：弯曲下粘结异种板界面裂纹的应力强度因子分析

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摘要

This paper presents the simple method to determine the complex stress intensity factor of interface crack in bi-material plate under bending. In the present method, the stress values at the crack tip calculated by FEM are used and the stress intensity factors of interface crack are evaluated from the ratio of stress values between a given and a reference problems. A single interface crack in an infinite bi-material plate subjected to tension and shear is selected as the reference problem in this study. The accuracy of the present analysis is discussed through the results obtained by body force method. As the result, it is confirmed that the present method is useful for analyzing the interface crack under bending.
机译：本文提出了一种简单的方法来确定双材料板弯曲时界面裂纹的复合应力强度因子。在本方法中，使用通过有限元法计算的裂纹尖端处的应力值，并根据给定问题和参考问题之间的应力值之比评估界面裂纹的应力强度因子。本研究选择了无限双材料板受拉和剪切的单界面裂纹作为参考问题。通过体力法获得的结果讨论了本分析的准确性。结果，证实了本方法对于分析弯曲下的界面裂纹是有用的。

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