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首页> 外文期刊>Key Engineering Materials >Comparison of Processing Features between Semi Bonded Abrasive Lapping and Loose Abrasive Lapping
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Comparison of Processing Features between Semi Bonded Abrasive Lapping and Loose Abrasive Lapping

机译:半粘结磨具和松散磨具的加工性能比较

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摘要

Semi bonded abrasive lapping is an effective ultra-precision lapping method. It can obtain good surface quality of workpiece in short time. This paper focused on the differences of processing features by comparing semi bonded abrasive lapping and loose abrasive lapping in several groups processing parameters. The results showed that the surface roughness of workpiece in semi bonded abrasive lapping was far superior to that of loose abrasive lapping in same processing parameters. And the MRR (material removal rate) of semi bonded abrasive lapping was slightly lower than that of loose abrasive lapping. For these features of semi bonded abrasive, a new processing flow would also be proposed in this paper.
机译:半粘结磨料研磨是一种有效的超精密研磨方法。可以在短时间内获得良好的工件表面质量。通过比较半组磨料研磨和松散磨料研磨在几个加工参数组中的不同,本文着重研究了加工特性的差异。结果表明,在相同的加工参数下,半粘结磨具的工件表面粗糙度要远远优于疏松磨具。并且,半粘结磨具的MRR(材料去除率)略低于松散磨具的MRR(材料去除率)。针对半粘结磨料的这些特性,本文还将提出一种新的工艺流程。

著录项

  • 来源
    《Key Engineering Materials》 |2009年第2009期|439-442|共4页
  • 作者

    Xun Lv; Julong Yuan; Donghui Wen;

  • 作者单位

    The MOE Key Laboratory of Mechanical Manufacture and Automation, Zhejiang University of Technology, Hangzhou, China, 310032;

    The MOE Key Laboratory of Mechanical Manufacture and Automation, Zhejiang University of Technology, Hangzhou, China, 310032;

    The MOE Key Laboratory of Mechanical Manufacture and Automation, Zhejiang University of Technology, Hangzhou, China, 310032;

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  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

    semi bonded abrasive lapping; loose abrasive lapping; processing features;

    机译:半粘结磨具研磨剂的研磨松动;处理功能;

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