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Microstructure and Properties of Environmental-friendly Sip/4032Al Composites Used for Electronic Packaging

机译：电子包装用环保Sip / 4032Al复合材料的组织和性能

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摘要

Sip/4032Al composites for electronic packaging applications with high volume fraction of Si particles were fabricated by squeeze-casting technology. The microstructure observation showed that the composites were dense and Si particles distributed uniformly, The interfaces and the existance of the interface reaction were the important factors which affected the properties of the composites; The linear CTEs of Sip/4032Al composites was between (8.1 ～ 12) ×10~(-6)℃~(-1), and they were decreased with the increasing content of Si particles as well as annealing treatment. Kerner model can predict the CTEs of Sip/4032Al composites moderately; the thermal conductivity can reach 103W/ (m·℃), which was decreased with the increasing contents of Si particles as well as annealing treatment. The thermal conductivity of composite calculated was larger than tested values. The composites had excellent mechanical properties and also could be recycled.
机译：通过挤压铸造技术制造了具有高体积分数的硅颗粒的用于电子包装应用的Sip / 4032Al复合材料。显微组织观察表明，复合材料致密，硅颗粒分布均匀，界面和界面反应的存在是影响复合材料性能的重要因素。 Sip / 4032Al复合材料的线性CTE在（8.1〜12）×10〜（-6）℃〜（-1）之间，随着Si颗粒含量的增加和退火处理的增加而降低。 Kerner模型可以适度地预测Sip / 4032Al复合材料的CTE。热导率可达103W /（m·℃），随着Si颗粒含量的增加和退火处理的增加而降低。计算出的复合材料的热导率大于测试值。该复合材料具有优异的机械性能，也可以回收利用。

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