Experimental Study of Stress Behavior under High Temperature using New Device by Photoelasticity Methods

Syuutei Sasakir; Tsutomu Ezumie

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Experimental Study of Stress Behavior under High Temperature using New Device by Photoelasticity Methods

机译：新设备光弹性法研究高温应力行为

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In recent society, the lap joint that is one of the joint techniques in the industrial society is used for the purpose of joint with the material and the material or the material and the metal and dissimilar materials. We are given the favor in the daily life for the merchandise, the tool and the other goods. The studies of concerning of the lap joint such as the analysis of the surface for the adhesive and the adherent are reported. There is much report about the FEM, but the experimental analysis is not much. Especially, the thermal stress analysis of the lap joint is reported a few. These are almost about the FEM methods, but the report of the thermal analysis is few. The authors think that the experimental analysis is not enough about the study of the thermal analysis and tried to experiment the stress of the adherent. Therefore the authors tried to analyze using the photoelasticity methods. The authors made for the device to analyze the under same temperature of around the circumstance. This new device keeps the temperature constantly; the adhesive and the adherent are keeping in this device. This was observed the variation of the stress under constant temperature. It was obtained the result that the stress of the adhesive joint was influenced about the heat.

机译：在最近的社会中，作为工业社会中的接合技术之一的搭接接头被用于与材料和材料或材料与金属和异种材料进行接合的目的。商品，工具和其他商品在日常生活中受到青睐。报道了关于搭接接头的研究，例如对粘合剂和被粘物的表面的分析。关于有限元的报道很多，但实验分析却不多。特别是，关于搭接部的热应力分析的报道很少。这些几乎与有限元方法有关，但是热分析的报告很少。作者认为，对于热分析的研究，实验分析还不够，因此尝试对被粘物的应力进行实验。因此，作者试图使用光弹性方法进行分析。作者为该设备分析了周围相同温度下的环境。这种新设备可保持温度恒定。粘合剂和被粘物将保留在该设备中。观察到在恒定温度下应力的变化。得到的结果是，粘合接头的应力受到热量的影响。

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来源
《Key Engineering Materials》 |2006年第pt1期|p.717-722|共6页
作者
Syuutei Sasakir; Tsutomu Ezumie;
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作者单位

3-7-5 Toyosu Kouto-ku Tokyo, Japan, Zip 135-8548 Graduate School, Department of Engineering, Shibaura Institute of Technology;

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原文格式 PDF
正文语种 eng
中图分类工程基础科学;
关键词
experimental study; thermal stress analysis; photoelasticity methods; new device; lap joint;

机译：实验研究;热应力分析;光弹性方法;新装置;搭接;

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Experimental Study of Stress Behavior under High Temperature using New Device by Photoelasticity Methods

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