Analysis of temperature and speed effects on the drawing stress for improving the wire drawing process

A. Haddi; A. Imad; G. Vega

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Analysis of temperature and speed effects on the drawing stress for improving the wire drawing process

机译：分析温度和速度对拉拔应力的影响，以改善拉丝工艺

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This paper deals with experimental investigations in order to study the influence of drawing conditions on temperature rise and drawing stress in cold drawn copper wires. In the multipass drawing machine, the temperature rise and drawing stress are measured with thermocouples and load cell systems, respectively, for different drawing speeds. The results obtained show that the drawing stress and temperature rise vary during the drawing process. This certainly comes from the variation of the friction coefficient and the flow stress of the material depending on the drawing speed. From the experimental results, a relationship between temperature rise, drawing stress and friction coefficient is built. Based on this, a modification of Avitzur's model is presented. This new model can help to select the process parameters which satisfy the conditions of minimum drawing stress for copper material.

机译：为了研究拉拔条件对冷拔铜线中温升和拉拔应力的影响，本文进行了实验研究。在多道次拉伸机中，对于不同的拉伸速度，分别使用热电偶和称重传感器系统测量温度升高和拉伸应力。获得的结果表明，拉拔过程中拉拔应力和温升会发生变化。当然，这取决于材料的摩擦系数和流变应力（取决于拉伸速度）的变化。根据实验结果，建立了温升，拉伸应力和摩擦系数之间的关系。在此基础上，提出了对Avitzur模型的修改。这个新模型可以帮助选择满足铜材料最小拉拔应力条件的工艺参数。

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来源
《Materials & design》 |2011年第9期|p.4310-4315|共6页
作者
A. Haddi; A. Imad; G. Vega;
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作者单位

Univ Lille Nord de France, F-59000 Lille, France,Laboratoire Genie Civil et geo-Environnement (LGCgE), Faculte des Sciences Appliquees, Universite d'Artois, F-62400 Bethune, France;

Univ Lille Nord de France, F-59000 Lille, France,Laboratoire de Mecanique de Lille, CNRS UMR 8107, Polytech'Lille, Universite Lillel, Avenue Langevin, F-59655 Villeneuve d'Ascq, France;

Nexans Research Centre, Boulevard du Marais, BP: 39, F-62301 Lens, France;

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正文语种 eng
中图分类
关键词
A. non-ferrous metals and alloys; C. drawing; G. thermal analysis;

机译：A.有色金属及其合金;C.图纸;G.热分析;

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Analysis of temperature and speed effects on the drawing stress for improving the wire drawing process

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