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Effect of thiourea and lead acetate on the deposition of electroless nickel

机译:硫脲和乙酸铅对化学镀镍沉积的影响

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摘要

Thiourea and lead acetate were selected for comparison of their effects on deposition rate, crystallinity, surface morphology, and phosphorus content of electroless nickel deposit. In the investigated pH range 4-5, thiourea gives rise to higher deposition rates yet lower phosphorus contents than lead acetate. The results of SEM and AFM investigation show that coarse nodule and relatively rough surface morphology are obtained in the presence of thiourea. A higher pH value as well as a greater thiourea concentration tends to enhance the crystallization of the electroless nickel deposit.
机译:选择硫脲和乙酸铅来比较它们对化学镀镍沉积物的沉积速率,结晶度,表面形态和磷含量的影响。在所研究的pH范围4-5中,与乙酸铅相比,硫脲的沉积速率更高,磷含量更低。 SEM和AFM研究的结果表明,在硫脲存在下,可获得粗大的结节和相对粗糙的表面形态。较高的pH值和较高的硫脲浓度往往会增强化学镀镍沉积物的结晶。

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