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Thermal embrittlement and microstructure change in electrodeposited Ni

机译：电沉积镍的热脆化和微观结构变化

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摘要

Thermal embrittlement due to sulfur (S) segregation to the grain boundaries (GBs) in electrodeposited Ni and Ni alloys have been previously reported. In this study, microstructural changes in electrodeposited Ni with 220 ppm S transitioning from ductile to brittle fracture were observed by electron backscatter diffraction (EBSD) to determine the types of microstructure that result in thermal embrittlement. Tensile tests of the electrodeposited Ni after annealing showed decreasing tensile elongation to zero with increasing annealing temperature or time. Auger analysis of the fracture surface indicated that thermal embrittlement was due to GB segregation of S. This behavior diverges from the average grain size and fraction of kernel average misorientation detected by EBSD analysis but can be explained by considering average size of the recrystallized grains with (111) orientation. Furthermore, the S concentration at the GBs estimated using the size of recrystallized grains agreed with the values obtained from the Auger analysis. Thus, the S-rich GBs that lead embrittlement, were formed primarily by recrystallization.
机译：先前已经报道了由于电沉积的Ni和Ni合金中的硫（S）偏析到晶界（GBs）而引起的热脆化。在这项研究中，通过电子背散射衍射（EBSD）观察到电沉积Ni中220 ppm S从韧性断裂转变为脆性断裂的微观结构变化，以确定导致热脆化的微观结构类型。退火后电沉积Ni的拉伸试验表明，随着退火温度或时间的增加，拉伸伸长率降低至零。断裂面的俄歇分析表明，热脆化是由于S的GB偏析所致。此行为与EBSD分析所检测到的平均晶粒尺寸和平均晶粒取向不良分数不同，但可以通过考虑具有（ 111）方向。此外，使用再结晶晶粒的尺寸估算的GBs的S浓度与从俄歇分析获得的值一致。因此，导致脆化的富含S的GBs主要是通过重结晶形成的。

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