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Microstructural evolution and mechanical behavior of copper processed by low strain amplitude multi-directional forging

机译：低应变振幅多方向锻造铜的组织演变和力学行为

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摘要

Experiments were performed to analyze the microstructural evolution and mechanical behavior of commercial purity copper (99.8%) processed by up to 48 cycles of multi-directional forging (MDF) using a low strain amplitude of similar to 0.075 (total accumulated strain epsilon approximate to 10.8). Parabolic work-hardening concomitantly with increasing dislocation densities was observed up to epsilon approximate to 2, followed by a practically constant flow stress due to dynamic recovery. The average grain size was reduced from 30.5 mu m in the annealed metal down to 4.1 mu m for epsilon approximate to 7.2; the fraction of sub-micrometric grains reached similar to 12% for epsilon approximate to 10.8. The microstructural changes were attributed to the fragmentation of the original grains by dislocation structures having low misorientation angles which gradually evolved into arrays of high-angle grain boundaries with increasing numbers of MDF cycles. The Cu samples subjected to 48 cycles of MDF displayed limited dynamic recrystallization, exhibiting basically dislocation cells and sub-grains with an average size of 0.6 mu m. It is demonstrated that low strain amplitude MDF delays the kinetics of grain refinement in copper compared with MDF using higher strain amplitudes.
机译：进行了实验以分析通过多达48个多方向锻造（MDF）循环加工的商品级纯铜（99.8％）的微观结构演变和力学行为，使用的低应变幅度近似于0.075（总累积应变ε约为10.8） ）。观察到抛物线工作硬化伴随位错密度的增加，直到ε接近2为止，随后由于动态恢复而产生了几乎恒定的流动应力。平均晶粒尺寸从退火金属中的30.5微米减小到ε约为4.1的4.1微米。对于ε而言，亚微米级颗粒的比例接近12％，约为10.8。微观结构的变化归因于低取向角的位错结构使原始晶粒破碎，随着MDF循环次数的增加，该位错结构逐渐演变成高角度晶界阵列。经受48个MDF循环的Cu样品显示出有限的动态重结晶，基本表现出位错胞和亚晶粒，平均尺寸为0.6μm。结果表明，与使用较高应变幅度的MDF相比，低应变幅度MDF延迟了铜晶粒细化的动力学。

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