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首页> 外文期刊>Materials Science and Engineering >Mechanical characterizations of single-crystalline (Cu, Ni)_6Sn_5 through uniaxial micro-compression
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Mechanical characterizations of single-crystalline (Cu, Ni)_6Sn_5 through uniaxial micro-compression

机译：通过单轴微压缩对单晶（Cu，Ni）_6Sn_5的力学表征

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摘要

Microelectronic industry is experiencing a major paradigm shift from the conventional two-dimensional into hierarchical three-dimensional integrated circuits (3D ICs). In 3D IC technology, through-silicon-vias and micro joints are regarded as the two vital interconnection processes to achieve higher packing density as well as heterogeneous integration. However, the miniaturization of solder joints down to micron level causes the consequence that intermetallic compounds takes up most of the volume of micro joints within a short period of time, in stark contrast to the well-known scenario at the opposite end of spectrum that soft Sn-based solders always occupies a high volume fraction of joints. Thus, intermetallics are expected to shoulder primary responsibilities of mechanical reliability in micro joints. Therefore, a full understanding about the mechanical behaviors of intermetallics at micron scale is essential for validity and reliability evaluation of 3D IC interconnections. The present study focuses on mechanical assessment of single-crystalline (Cu, Ni)(6)Sn-5 by means of uniaxial micro-compression and nanoindentation. The anisotropic mechanical properties of hexagonal Cu6Sn5 are investigated by compression testing on single-crystalline Cu6Sn5 micropillars with different grain orientations. The jammed network of dislocation inside deformed micropillars suggests that intermittent strain bursts in stress-strain curves are relevant to dislocation-avalanche mechanism. In addition, Cu6Sn5 micropillars are found to exhibit brittle cleavage failure with most fractured pieces crushed in the same direction, and one set of preferred cleavage plane are characterized by post-mortem analysis. Moreover, the strengthening and phase stabilizing effect of Ni element on Cu6Sn5 is also investigated by micropillar compression and X-ray diffraction, respectively.
机译：微电子工业正经历着从传统的二维到分层的三维集成电路（3D IC）的重大模式转变。在3D IC技术中，硅通孔和微连接被视为实现更高封装密度和异构集成的两个至关重要的互连过程。然而，焊点的最小化到微米水平会导致以下结果：金属间化合物在短时间内占据了大部分的微接点，这与光谱相反端的众所周知的情况形成了鲜明的对比。锡基焊料总是占焊缝的很大一部分。因此，金属间化合物有望担负起微接头机械可靠性的主要责任。因此，对于3D IC互连的有效性和可靠性评估，充分了解微米级金属间化合物的机械行为至关重要。本研究的重点是通过单轴微压缩和纳米压痕对单晶（Cu，Ni）（6）Sn-5进行机械评估。通过对具有不同晶粒取向的单晶Cu6Sn5微柱进行压缩测试，研究了六角形Cu6Sn5的各向异性力学性能。变形微柱内部的位错被堵塞的网络表明，应力-应变曲线中的间歇性应变爆发与位错-雪崩机制有关。此外，发现Cu6Sn5微柱表现出脆性的断裂破坏，大多数破裂的碎块都沿相同方向压碎，并且通过事后分析对一组优选的断裂面进行了表征。此外，还分别通过微柱压缩和X射线衍射研究了Ni元素对Cu6Sn5的强化作用和相稳定作用。

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