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Effects of Mg addition on the microstructure and softening resistance of Cu-Cr alloys

机译：Mg添加对Cu-Cr合金组织和抗软化性的影响

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摘要

In this study, Cu-0.535Cr and Cu-0.535Cr-0.1 Mg are used to research the effects of Mg on the microstructure, physical properties, and softening resistance of Cu-Cr alloy. The mechanical properties and softening resistance of Cu-Cr alloy improve by adding Mg element, whereas its conductivity slightly decreases. The hardness, electrical conductivity, tensile strength, and yield strength of Cu-Cr-Mg alloy are 170.1 HV, 77.8% IACS, 519 MPa, and 472 MPa, respectively, after cold rolling by 60% and aging at 450 ℃ for 60 min. The strengthening mechanism of the studied alloys aging at 450 ℃ for 60 min is chiefly ascribed to the Orowan precipitation and dislocation strengthening, and is slightly contributed by solid solution strengthening. The softening temperatures of Cu-0.535Cr and Cu-0.535Cr-0.1 Mg alloys are 525 ℃ and 575 ℃, respectively. The softening of the alloys is accompanied by the growth of Cr precipitates and the occurrence of recrystallization behavior. Mg atoms diffuse from the Cr precipitates to the Cu matrix during annealing, and the Mg atoms distributed in the precipitate-matrix interface retard the growth and coarsening of Cr precipitates. The fine Cr precipitates and Mg atoms dissolved in the matrix fix the dislocation and boundary, resulting in excellent physical properties and softening resistance of Cu-Cr-Mg alloy.
机译：在这项研究中，使用Cu-0.535Cr和Cu-0.535Cr-0.1 Mg来研究Mg对Cu-Cr合金的组织，物理性能和抗软化性的影响。添加Mg元素可改善Cu-Cr合金的力学性能和抗软化性，而电导率则略有下降。 Cu-Cr-Mg合金冷轧60％并在450℃时效60分钟后，其硬度，电导率，拉伸强度和屈服强度分别为170.1 HV，77.8％IACS，519 MPa和472 MPa。 。所研究的合金在450℃时效60分钟时效的强化机理主要归因于Orowan析出和位错强化，而固溶强化则略有贡献。 Cu-0.535Cr和Cu-0.535Cr-0.1 Mg合金的软化温度分别为525℃和575℃。合金的软化伴随着Cr沉淀物的生长和再结晶行为的发生。 Mg原子在退火过程中从Cr沉淀扩散到Cu基体，分布在沉淀-基体界面的Mg原子阻碍了Cr沉淀的生长和粗化。细小的Cr沉淀物和溶解在基体中的Mg原子固定了位错和边界，从而获得了优异的物理性能和Cu-Cr-Mg合金的抗软化性。

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  • 来源
    《Materials Science and Engineering》 |2020年第3期|139009.1-139009.10|共10页
  • 作者

    Yuqing Sun; Lijun Peng; Guojie Huang; Haofeng Xie; Xujun Mi; Xinhua Liu;

  • 作者单位

    Sate Key Laboratory of Nonferrous Metals and Processes GRIMAT Group Co. Ltd. Beijing 101407 China Key Laboratory for Advanced Materials Processing (MOE) University of Science and Technology Beijing Beijing 100083 China GRIMAT Engineering Institute Co. Ltd Beijing 101407 China General Research Institute for Nonferrous Metals Beijing 100088 China;

    Sate Key Laboratory of Nonferrous Metals and Processes GRIMAT Group Co. Ltd. Beijing 101407 China General Research Institute for Nonferrous Metals Beijing 100088 China;

    Sate Key Laboratory of Nonferrous Metals and Processes GRIMAT Group Co. Ltd. Beijing 101407 China GRIMAT Engineering Institute Co. Ltd Beijing 101407 China;

    Key Laboratory for Advanced Materials Processing (MOE) University of Science and Technology Beijing Beijing 100083 China Beijing Laboratory of Metallic Materials and Processing for Modern Transportation Beijing 100083 China;

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  • 原文格式 PDF
  • 正文语种 eng
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  • 关键词

    Cu-Cr-Mg alloy; Softening resistance; Strengthening mechanism; Softening mechanism;

    机译：Cu-Cr-Mg合金;耐软化性加强机制;软化机制;

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