Abstract Characterization of soldering alloy type Zn-In-Mg and the study of direct soldering of silicon and copper
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Characterization of soldering alloy type Zn-In-Mg and the study of direct soldering of silicon and copper

机译：Zn-In-Mg焊接合金的表征及硅铜直接焊接的研究

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AbstractThe aim of study was to characterize the Zn-In-Mg soldering alloy type and investigate the direct soldering of silicon and copper. The Zn-In-Mg solder type has a broad interval of melting, which depends on the indium content in the solder. Solder microstructure is formed of a matrix with pure Zn. The MgZn2phases and solid solution (In) β-In are precipitated along the grain boundaries. Tensile strength attains values from 46 to 124MPa and is dependent on indium content. The bond with silicon is formed due to the reactions of active metals - In and Mg with the substrate surface. Diffraction analysis has also revealed the In13Mg7phase. In spite of that, the bond formation with a copper substrate in not affected by In and Mg content. The bond is formed owing to interaction between the zinc from the solder and copper substrates. Two phases, namely CuZn4and Cu5Zn8were observed. The shear strength of Cu/Zn-In-Mg/Cu joints attains values from 56 to 62MPa and the shear strength of Si/Zn-In-Mg/Cu joint is within 34–42MPa.
机译： 摘要 研究的目的是表征Zn-In-Mg焊接合金的类型，并研究硅和铜的直接焊接。 Zn-In-Mg焊料类型的熔化间隔很宽，这取决于焊料中的铟含量。焊料微结构由具有纯Zn的基质形成。 MgZn 2 相和固溶体（In）β-In沿晶界析出。拉伸强度达到46至124MPa，并取决于铟含量。由于活性金属-In和Mg与基板表面的反应，形成了与硅的键合。衍射分析还揭示了In 13 Mg 7 相。尽管如此，与铜基底的键形成不受In和Mg含量的影响。由于焊料中的锌与铜基板之间的相互作用而形成了键。两个阶段，即CuZn 4 和Cu 5 Zn 4 “> 8 被观察到。 Cu / Zn-In-Mg / Cu接头的剪切强度达到56-62MPa，Si / Zn-In-Mg / Cu接头的剪切强度在34-42MPa之间。 < / ce：abstract-sec>

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