High temperature stabilization of a nanostructured Cu-Y_2O_3 composite through microalloying with Ti

著录项

• 来源
  《Materials Science and Engineering》 |2018年第17期|80-87|共8页
• 作者

  Dengshan Zhou; Hongwei Geng; Wei Zeng; Dengqi Zheng; Hucheng Pan; Charlie Kong; Paul Munroe; Gang Sha; Challapalli Suryanarayana; Deliang Zhang;

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• 作者单位

  Key Laboratory for Anisotropy and Texture of Materials (Ministry of Education), Northeastern University,Institute of Ceramics and Powder Metallurgy, School of Materials Science and Engineering, Northeastern University;

  Key Laboratory for Anisotropy and Texture of Materials (Ministry of Education), Northeastern University,Institute of Ceramics and Powder Metallurgy, School of Materials Science and Engineering, Northeastern University;

  State Key Laboratory for Metal Matrix Materials, School of Materials Science and Engineering, Shanghai Jiao Tong University;

  State Key Laboratory for Metal Matrix Materials, School of Materials Science and Engineering, Shanghai Jiao Tong University;

  Key Laboratory for Anisotropy and Texture of Materials (Ministry of Education), Northeastern University;

  Electron Microscopy Unit, The University of New South Wales;

  School of Materials Science and Engineering, The University of New South Wales;

  Herbert Gleiter Institute of Nanoscience, School of Materials Science and Engineering, Nanjing University of Science and Technology;

  Department of Mechanical and Aerospace Engineering, University of Central Florida;

  Key Laboratory for Anisotropy and Texture of Materials (Ministry of Education), Northeastern University,Institute of Ceramics and Powder Metallurgy, School of Materials Science and Engineering, Northeastern University;

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• 原文格式 PDF
• 正文语种 eng
• 中图分类
• 关键词

  Oxide dispersion-strengthened Cu; Nanocrystalline metal matrix composite; Thermal stability; Ti addition; Microalloying; Hall-Petch relation;

  机译：氧化物弥散强化铜;纳米晶金属基复合材料;热稳定性;钛添加;微合金化;霍尔-Petch关系;