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Characterization of creep deformation of Ni-Cr solid solution alloy Nimonic 75

机译：Ni-Cr固溶合金Nimonic 75蠕变变形的表征

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Creep testing of Nimonic alloy 75, a simple Ni-Cr solid solution alloy was carried out over the temperature range 873-950 K (600-677 °C) at 160 MPa. The activation energy for creep was found to vary over this temperature range, and suggests that two deformation processes occur simultaneously, dislocation climb within the grains along with grain boundary (Coble) diffusional creep. Under these conditions the material also exhibits a sigmoidal rather than normal primary creep transient. Despite this, the characteristics of Class I solid solution creep are not observed. The sigmoidal primary transient is explained in terms of a transition from dislocation mobility-controlled (initial stage of sigmoidal primary transient) to substructure-controlled deformation (second stage of sigmoidal primary transient). A reduction in sample size has been found to reduce the early stage creep resistance of this material. This size effect is analyzed in terms of the sample volume to surface area ratio (V/S) and agrees well with size effect results reported in the literature.
机译：镍合金75（一种简单的Ni-Cr固溶合金）的蠕变测试是在873-950 K（600-677°C）的温度范围内，160 MPa进行的。发现蠕变的活化能在此温度范围内变化，表明两个变形过程同时发生，位错在晶粒内随晶界（Coble）扩散蠕变而上升。在这些条件下，材料还呈现出S型，而不是正常的初级蠕变瞬变。尽管如此，仍未观察到I类固溶体蠕变的特性。从位错迁移率控制（S型初生过渡的初始阶段）到子结构控制的变形（S型初生过渡的第二阶段）的过渡来解释S型初生过渡。已经发现减小样品尺寸会降低这种材料的早期抗蠕变性。根据样品体积与表面积之比（V / S）分析这种尺寸效应，并且与文献中报道的尺寸效应结果非常吻合。

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