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首页> 外文期刊>Materials Science and Engineering >Lead free Sn-Ag-Cu solders reinforced by Ni-coated graphene nanosheets prepared by mechanical alloying: Microstructural evolution and mechanical durability
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Lead free Sn-Ag-Cu solders reinforced by Ni-coated graphene nanosheets prepared by mechanical alloying: Microstructural evolution and mechanical durability

机译：机械合金化制备的镀镍石墨烯纳米片增强的无铅锡-银-铜焊料：微观结构演变和机械耐久性

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As one of the key technologies for high performance electronic devices, composite solders have been developed to improve the thermal and mechanical properties of soldered joints. In this research, mechanical alloying was employed to fabricate the lead-free tin-based nanocomposite solders. The nanocomposite composed of a Sn-Ag-Cu ternary eutectic alloy reinforced by graphene nano-sheets (GNSs). Since the tin alloy melt do not wet the surfaces of GNSs, interface bonding between the metal matrix and these inclusions was promoted with decorating of the nano-sheets by a thin layer of chemically-deposited nickel. It was shown that nickel coating significantly improves the distribution of GNSs throughout the SAC matrix prepared by the severe plastic deformation route. Additionally, brittle and elongated intermetallic compounds were significantly refined to distribute the particles with an average diameter of a few hundred nanometers. Microstructural studies also revealed a recrystallized fine-grained and eutectic morphology for the SAC alloy matrix before and after soldering, respectively. The role of Ni-coated GNSs on retarding the growth of intermetallic phases upon soldering process is presented. We have employed a solid-state post ageing process to enhance the mechanical properties of the developed soldered joints by precipitation hardening mechanism assisted by nano-sheets, as well. Enhanced strength and ductility of the copper soldered joints prepared by the nanocomposite solder is shown. A maximum enhancement of ~ 65% in the tensile-shear strength is reported, while the ductility preserved up to - 63%, as well.%Lead-free solder; Eutectic Sn-Ag-Cu alloy; Nanocomposite; Graphene nano-sheets; Ni-coating; Mechanical alloying
机译：作为高性能电子设备的关键技术之一，已经开发了复合焊料来改善焊接接头的热性能和机械性能。在这项研究中，机械合金化被用来制造无铅锡基纳米复合焊料。纳米复合材料由石墨烯纳米片（GNS）增强的Sn-Ag-Cu三元共晶合金组成。由于锡合金熔体不会润湿GNS的表面，因此通过化学沉积的镍薄层修饰纳米片，可以促进金属基体与这些夹杂物之间的界面结合。结果表明，镍涂层显着改善了通过严重塑性变形途径制备的SAC基质中GNS的分布。另外，对脆性和伸长的金属间化合物进行了显着改进，以分布平均直径为几百纳米的颗粒。显微组织研究还揭示了SAC合金基体在焊接之前和之后分别重结晶的细晶和共晶形态。提出了镍镀层的GNS在阻焊过程中对金属间相生长的抑制作用。我们还采用了固态后老化工艺，以通过纳米片辅助的沉淀硬化机制来增强已开发焊接接头的机械性能。显示了由纳米复合焊料制备的铜焊接接头的增强的强度和延展性。据报道，拉伸剪切强度最大提高了〜65％，而延展性也保持了-63％。共晶Sn-Ag-Cu合金;纳米复合材料石墨烯纳米片；镀镍；机械合金化

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