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Critical evaluation of creep behavior of Sn-Ag-Cu solder alloys over wide range of temperatures

机译：对Sn-Ag-Cu焊料合金在宽温度范围内的蠕变行为的严格评估

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摘要

A critical survey of the current literature on creep behavior of Pb-free Sn based Sn-Ag-Cu (SAC) alloys show that there is considerable discrepancy in the creep parameters, such as activation energy, Q., and stress exponent, n. Accordingly, this study addresses the underlying reasons for such variability in the existing data by studying the creep behavior in compression of two most commonly used SAC alloys, namely Sn-1 wt.%Ag-0.5 wt.%Cu and Sn-3 wt.% Ag-0.5 wt.% Cu, over wide range of temperatures, from 60 to 200 ℃, and stresses from 7 to 14 MPa. Analysis of microstructure of SAC alloys reveals that both temperature and stress have pronounced effects on coarsening of precipitates during creep. The steady state strain rate increases with both temperature and stress as well as with decrease in Ag content of the alloys. Irrespective of the composition, SAC alloys show a transition in the creep behavior around 150 ℃, with Q_c and n changing from 55 kJ/mol and 7, respectively, at low temperatures to 100 kj/mol and 5, respectively, at higher temperatures. Such a simultaneous change in both Q_c and n suggests that creep mechanism in SAC alloys is dislocation climb controlled by the core diffusion at low temperatures and the lattice diffusion at high temperatures.
机译：对有关无铅锡基锡-银-铜（SAC）合金蠕变行为的最新文献的重要调查表明，蠕变参数（例如活化能Q和应力指数n）存在很大差异。因此，这项研究通过研究两种最常用的SAC合金（Sn-1 wt。％Ag-0.5 wt。％Cu和Sn-3 wt。％）在压缩时的蠕变行为，解决了现有数据中此类变化的根本原因。 ％Ag-0.5 wt。％Cu，在60至200℃的宽温度范围内，应力为7至14 MPa。对SAC合金的微观结构的分析表明，温度和应力均对蠕变过程中析出物的粗化具有显着影响。稳态应变速率随温度和应力以及合金中Ag含量的降低而增加。无论组成如何，SAC合金在150℃左右都表现出蠕变行为的转变，Q_c和n在低温下分别从55 kJ / mol和7变为高温下的100 kj / mol和5。 Q_c和n的这种同时变化表明，SAC合金的蠕变机理是位错爬升受低温下的核扩散和高温下的晶格扩散控制。

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