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Effects of coupled stressing and solid-state aging on the mechanical properties of graphene nanosheets reinforced Sn-58Bi-0.7Zn solder joint

机译:耦合应力和固态时效对石墨烯纳米片增强Sn-58Bi-0.7Zn焊点力学性能的影响

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摘要

With the addition of 0.075 wt% graphene nanosheets (GNSs), the mechanical properties of coupled and aged solder joint were respectively investigated in this study. During the tensile tests, the weakening of the anode interface between intermetallic compounds (IMCs) and Bi layer significantly affected the ultimate tensile strength (UTS) of electromigration (EM) and thermal aging coupled solder joint. The formation of vacancies and stress concentration at the Cu-Sn-Zn/Cu-Zn interface in the aged solder joint was ascribed to the Bi segregation and GNSs. Nanoindentation results showed that the creep resistance of coupled solder joint was higher than that of the aged solder joint which was because that the Bi layer, GNSs and cracks played a role of load transfer at the solder joint interface in coupled sample.
机译:通过添加0.075 wt%的石墨烯纳米片(GNS),本研究分别研究了耦合和老化焊点的机械性能。在拉伸试验过程中,金属间化合物(IMC)和Bi层之间的阳极界面的削弱显着影响了电迁移(EM)和热老化耦合焊点的极限拉伸强度(UTS)。老化焊点中Cu-Sn-Zn / Cu-Zn界面处空位的形成和应力集中归因于Bi偏析和GNS。纳米压痕结果表明,耦合焊点的抗蠕变性比老化焊点高,这是因为Bi层,GNS和裂纹在耦合样品的焊点界面处承担了载荷传递的作用。

著录项

  • 来源
    《Materials Science and Engineering》 |2016年第10期|499-506|共8页
  • 作者

    Dongliang Ma; Ping Wu;

  • 作者单位

    Department of Applied Physics, Institute of Advanced Materials Physics, Tianjin Key Laboratory of Low Dimensional Materials Physics and Preparing Technology, Faculty of Science, Tianjin University, Tianjin 300072, PR China;

    Department of Applied Physics, Institute of Advanced Materials Physics, Tianjin Key Laboratory of Low Dimensional Materials Physics and Preparing Technology, Faculty of Science, Tianjin University, Tianjin 300072, PR China;

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  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

    Graphene nanosheets; Coupled stressing; Mechanical alloying; Nanoindentation;

    机译:石墨烯纳米片;耦合压力;机械合金化;纳米压痕;

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