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Spall behaviors of high purity copper under sweeping detonation

机译：高纯铜在爆炸下的剥落行为

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摘要

Suites of sweeping detonation experiments were conducted to assess the spall behavior of high purity copper samples with different heat treatment histories. Incipient spall samples were obtained at different sweeping detonation condition. Metallographic and Electron Backscattered Diffraction (EBSD) analyses were performed on the soft-recovered samples. The effects of grain boundaries, grain size, crystal orientation and loading direction on the spall behaviors were discussed. Spall plane branching was found in the main spall plane of the damage samples. For similar microstructure, the area of voids increase with the increase of shock stress, and the coalescence of voids also become more obvious. Results from EBSD analysis show that the grain sizes were decreased and the grains were elongated along the direction of the plate width. Triple junctions composed of two or more general high angle boundaries are the preferred locations for intergranular damage. Voids prefer to nucleate in the grain boundaries composed of grain with high Taylor Factor (TF) than other grains. The damage areas in the grains with high TF are more severe. Boundaries close to perpendicular to the loading direction are more susceptible to void nucleation than the boundaries close to parallel to the loading direction, but the difference of voids nucleated in these two boundaries is less significant than the results obtained by plate impact experiment. It would be caused by the obliquity between the shock loading direction and the plate normal.
机译：进行了一系列的爆炸实验，以评估具有不同热处理历史的高纯度铜样品的剥落行为。在不同的爆轰条件下获得初始剥落样品。对软回收的样品进行了金相和电子背散射衍射（EBSD）分析。讨论了晶界，晶粒尺寸，晶体取向和加载方向对剥落行为的影响。在损伤样本的主剥离平面中发现了剥离平面分支。对于相似的微观结构，空隙的面积随着冲击应力的增加而增加，空隙的聚结也变得更加明显。 EBSD分析的结果表明，晶粒尺寸减小，晶粒沿板宽方向拉长。由两个或多个大角度边界构成的三重结是晶间破坏的首选位置。与其他晶粒相比，空洞更喜欢在由具有高泰勒因子（TF）的晶粒组成的晶粒边界中形核。 TF含量高的晶粒的损伤区域更为严重。接近垂直于加载方向的边界比接近平行于加载方向的边界更容易产生空核，但是在这两个边界中形成核的空洞的差异不如通过板冲击实验获得的结果显着。这可能是由于冲击载荷方向和板法线之间的倾斜所引起的。

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  • 来源
    《Materials Science and Engineering》 |2016年第10期|636-645|共10页
  • 作者

    Yang Yang; Peng Zhi-qiang; Chen Xing-zhi; Guo Zhao-liang; Tang Tie-gang; Hu Hai-bo; Zhang Qing-ming;

  • 作者单位

    School of Material Science and Engineering, Central South University, Changsha 410083, China,Institute of Fluid Physics, China Academy of Engineering Physics, Mianyang 621900, China,National Key Laboratory of Explosion Science and Technology, Beijing Institute of Technology, Beijing 100081, China,Key Laboratory of Nonferrous Metals Material Science and Engineering of Ministry of Education, Central South University, Changsha 410083, China;

    School of Material Science and Engineering, Central South University, Changsha 410083, China,Key Laboratory of Nonferrous Metals Material Science and Engineering of Ministry of Education, Central South University, Changsha 410083, China;

    School of Material Science and Engineering, Central South University, Changsha 410083, China,Key Laboratory of Nonferrous Metals Material Science and Engineering of Ministry of Education, Central South University, Changsha 410083, China;

    Institute of Fluid Physics, China Academy of Engineering Physics, Mianyang 621900, China;

    Institute of Fluid Physics, China Academy of Engineering Physics, Mianyang 621900, China;

    Institute of Fluid Physics, China Academy of Engineering Physics, Mianyang 621900, China;

    National Key Laboratory of Explosion Science and Technology, Beijing Institute of Technology, Beijing 100081, China;

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  • 原文格式 PDF
  • 正文语种 eng
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  • 关键词

    Sweeping detonation; Spall; Grain boundaries; Taylor factor; High purity copper;

    机译：清扫爆炸;剥落;晶界泰勒因子高纯铜;

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