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Effect of Ni and Sb additions and testing conditions on the mechanical properties and microstructures of lead-free solder joints

机译：镍和锑的添加及测试条件对无铅焊点力学性能和微观结构的影响

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Nowadays, one of the strategies to improve the reliability of lead-free solder joints is to add minor alloying elements to solders. Therefore, the aims of this study are to investigate the effect of Ni and Sb, as well as that of the testing conditions (temperature and strain rate), on the mechanical properties of two new lead-free solder joints, Sn-3.8Ag-0.7Cu-3Bi/Cu and Sn-3.8Ag-0.7Cu-3Bi0.2Ni1.54Sb/Cu. The changes, after testing, in their respective microstructure will also be investigated. The procedure to fabricate appropriate joint samples is described in this research. The shear tests were conducted by micro-tensile machine at temperatures between room temperature and 125 ℃ and strain rates between 2.0 × 10~(-4) s~(-1) and 2.0 × 10~(-2)s~(-1). The experimental results indicate that, with additions of Ni and Sb in Sn-3.8Ag-0.7Cu-3Bi, the ultimate tensile strength (UTS) and the yield stress (σ_y) are improved. Moreover, both temperature and strain rate may have substantial effects on the mechanical behavior and the micro-structural features of the solder alloys. During the shear tests, the strength decreases with the increase of the test temperature and/or the decrease of the strain rate. The enhanced strength is attributed to the solid solution hardening effects of Sb in the Sn matrix and the refinement of the microstructure with the addition of Ni. Ni and Sb additions lead to the formation of new (Cu, Ni)_6Sn_5 and Ag_3(Sn, Sb) IMCs. Needle-like (Cu, Ni)_6Sn_5 appeared in the Sn-3.8Ag-0.7Cu-3Bi0.2Ni1.54Sb/Cu, instead of the globular-like Cu_6Sn_5 inSn-3.8Ag-0.7Cu-3Bi/Cu. In addition, the nine Anand material parameters are identified using the shear stress-strain data and a non-linear least square fitting and its validity is checked by means of the experimental data. The findings found that these Anand parameters are also in good agreement with data given in literature for other solder alloys. The obtained material parameters of the Anand constitutive model were utilized to analyze the stress-strain response of an Insulated Gate Bipolar Transistor (IGBT) under thermal cycling. Furthermore, the SEM analysis of as-fabricated joint specimens as well as fractured specimens at different testing conditions was done to observe the effects of these factors on the microstructure of the solder alloys.
机译：如今，提高无铅焊点可靠性的策略之一是在焊料中添加微量合金元素。因此，本研究的目的是研究Ni和Sb以及测试条件（温度和应变率）对两种新型无铅焊点Sn-3.8Ag-的机械性能的影响。 0.7Cu-3Bi / Cu和Sn-3.8Ag-0.7Cu-3Bi0.2Ni1.54Sb / Cu。经过测试后，还将研究其各自微观结构的变化。在这项研究中描述了制作合适的关节样品的程序。在室温至125℃之间的温度下，通过微拉伸机进行剪切试验，应变率在2.0×10〜（-4）s〜（-1）和2.0×10〜（-2）s〜（-1）之间）。实验结果表明，在Sn-3.8Ag-0.7Cu-3Bi中添加Ni和Sb可以提高极限抗拉强度（UTS）和屈服应力（σ_y）。此外，温度和应变率都可能对焊料合金的机械性能和微观结构特征产生重大影响。在剪切试验期间，强度随着试验温度的升高和/或应变率的降低而降低。强度的提高归因于Sb在Sn基体中的固溶硬化作用，以及添加Ni改善了微观结构。添加Ni和Sb导致形成新的（Cu，Ni）_6Sn_5和Ag_3（Sn，Sb）IMC。 Sn-3.8Ag-0.7Cu-3Bi0.2Ni1.54Sb / Cu中出现了针状（Cu，Ni）_6Sn_5，而不是Sn-3.8Ag-0.7Cu-3Bi / Cu中出现了球状Cu_6Sn_5。另外，使用剪切应力-应变数据和非线性最小二乘拟合确定了9个Anand材料参数，并通过实验数据检查了其有效性。研究结果发现，这些Anand参数也与其他焊料合金文献中给出的数据非常吻合。利用获得的Anand本构模型的材料参数来分析绝缘栅双极晶体管（IGBT）在热循环下的应力-应变响应。此外，在不同的测试条件下对制成的接头试样和断裂试样进行了SEM分析，以观察这些因素对焊料合金微观结构的影响。

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